5CGXFC4C6F23I7N
| Part Description |
Cyclone® V GX Field Programmable Gate Array (FPGA) IC 240 2862080 50000 484-BGA |
|---|---|
| Quantity | 387 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FBGA (23x23) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BGA | Number of I/O | 240 | Voltage | 1.07 V - 1.13 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 18868 | Number of Logic Elements/Cells | 50000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 2862080 |
Overview of 5CGXFC4C6F23I7N – Cyclone® V GX Field Programmable Gate Array (FPGA) IC 240 I/O, ~2.86 Mbits RAM, 50k Logic Elements, 484-BGA
The 5CGXFC4C6F23I7N is an Intel Cyclone V GX FPGA in a 484-ball BGA package, designed for cost- and power-sensitive embedded systems. As a Cyclone V GX device, it leverages the Cyclone V family architecture to deliver a balance of programmable logic, embedded memory, and interface capability suitable for industrial and bandwidth-focused applications.
Key on-chip characteristics include 50,000 logic elements, approximately 2.86 Mbits of embedded memory, and 240 user I/O pins. The device is supplied for surface-mount assembly and operates over an industrial temperature range, with a narrow core voltage window for predictable power design.
Key Features
- Programmable Logic 50,000 logic elements (cells) provide flexible logic resources for control, state machines, and custom datapaths.
- Embedded Memory Approximately 2.86 Mbits of on-chip RAM to support buffering, lookup tables, and local storage for deterministic performance.
- I/O and Packaging 240 user I/O pins in a 484-BGA package (supplier package: 484-FBGA, 23 × 23 mm) for dense board-level connectivity; surface-mount mounting type for standard PCB assembly.
- Power Core supply specified at 1.07 V to 1.13 V, consistent with the Cyclone V family 1.1 V core voltage for controlled power budgeting.
- Operating Range Industrial operating temperature range from −40 °C to 100 °C for deployment in harsh environments.
- Family-Level Capabilities Built on TSMC 28 nm low-power (28LP) process technology; Cyclone V family features include enhanced 8-input adaptive logic modules (ALMs), variable-precision DSP blocks, M10K internal memory blocks, and integrated transceivers and hard memory-controller IP (family-level features).
- Regulatory RoHS compliant.
Typical Applications
- Industrial Control Deterministic logic and embedded memory make this FPGA suitable for motor control, PLC augmentation, and custom I/O aggregation in industrial systems.
- Networking & Telecom Interfaces Family-level transceiver and memory-controller capabilities support protocol bridging, packet buffering, and interface customization.
- Vision and Sensor Processing On-chip DSP primitives and local RAM enable preprocessing, filtering, and data reduction for sensor and camera front ends.
- Embedded System Glue Logic High I/O count and programmable fabric are useful for bridging buses, customizing peripherals, and offloading real-time tasks from a host processor.
Unique Advantages
- Balanced resource set: 50k logic elements paired with ~2.86 Mbits of embedded memory provides an effective mix for mid-density designs requiring both logic and local storage.
- Predictable power profile: Narrow core voltage range (1.07–1.13 V) simplifies power-supply design and helps keep thermal and power budgets controlled.
- Industrial-ready thermal range: −40 °C to 100 °C operating range supports deployment in a wide set of temperature-demanding applications.
- High I/O density in compact footprint: 240 I/O pins in a 484-FBGA (23 × 23 mm) package allow dense board routing while maintaining a relatively compact package size.
- Proven family architecture: Built on the Cyclone V platform (28 nm low-power process) with family-level features such as ALMs, DSP blocks, and M10K memory blocks to accelerate common FPGA functions.
- Regulatory compliance: RoHS compliance supports lead-free manufacturing and global market requirements.
Why Choose 5CGXFC4C6F23I7N?
The 5CGXFC4C6F23I7N positions itself as a mid-density Cyclone V GX FPGA that combines a practical mix of logic, embedded memory, and I/O in a surface-mount 484-BGA package. Its family-rooted architecture and 28 nm low-power process foundations make it a pragmatic choice for designs that require programmable flexibility, managed power consumption, and industrial temperature operation.
This device is well suited to engineers and product teams building embedded systems, industrial controllers, and interface-heavy subsystems who need predictable supply voltage, compact packaging, and a balance of on-chip logic and memory resources. The Cyclone V family heritage also offers an established ecosystem of tools and IP to support development and product lifecycle needs.
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