5CGXFC3B7U15C8N

The 5CGXFC3B7U15C8N is a Cyclone® V GX series FPGA in a 324‑LFBGA (324‑UBGA, 15×15) package optimized for surface‑mount assembly. It provides a mid‑range FPGA fabric with 31,500 logic elements, approximately 1.38 Mbits of embedded memory, and 144 general‑purpose I/Os for flexible system integration.

Designed for cost‑sensitive, high‑bandwidth applications, the Cyclone V family integrates low‑power process technology and family‑level hard IP to address embedded processing, connectivity, and memory interface requirements while operating within commercial temperature and voltage ranges.

Key Features

• Logic Capacity — 31,500 logic elements suitable for mid‑density logic integration and glue‑logic functions.
• On‑Chip Memory — Approximately 1.38 Mbits of embedded memory for data buffering, small LUT‑RAM or cache requirements.
• I/O — 144 user I/Os to support multiple parallel peripherals, external memory interfaces, and board‑level interconnects.
• Voltage Supply — Core supply range specified at 1.07 V to 1.13 V, with documented 1.1 V core reference in family materials.
• Package & Mounting — 324‑LFBGA (supplier package 324‑UBGA, 15×15); surface‑mount compatible for standard PCB assembly flows.
• Operating Range — Commercial temperature range, 0 °C to 85 °C.
• Family‑Level Capabilities — Cyclone V family documentation highlights TSMC 28‑nm low‑power process, enhanced 8‑input adaptive logic modules, variable‑precision DSP blocks, M10K embedded memory blocks, integrated transceivers and hard memory controller options, and available hard IP such as PCIe Gen1/Gen2 (family features as documented in the Cyclone V device overview).
• Compliance — RoHS‑compliant device.

Typical Applications

• Communications & Connectivity — Implements board‑level protocol glue logic and I/O aggregation using abundant I/Os and on‑chip memory.
• Embedded Control — Suitable for control logic, motor interface glue, and sensor processing where moderate logic density and on‑chip RAM are required.
• Memory Interface and Buffering — Acts as a hard/soft memory controller companion or buffer layer between processors and external memory using embedded RAM and I/O resources.

Unique Advantages

• Balanced Logic and Memory — 31,500 logic elements paired with approximately 1.38 Mbits of embedded memory addresses common mid‑range FPGA design needs without excess cost.
• Compact, Surface‑Mount Package — 324‑LFBGA (15×15) package enables high‑density board designs while remaining compatible with standard surface‑mount processes.
• Defined Commercial Operating Range — Clear specification of 0 °C to 85 °C supports commercial product development and procurement planning.
• Controlled Core Power Envelope — Narrow supply window (1.07–1.13 V) simplifies power‑rail planning for consistent core operation.
• RoHS Compliance — Meets RoHS requirements for environmentally focused supply chains and end products.

Why Choose 5CGXFC3B7U15C8N?

The 5CGXFC3B7U15C8N provides a practical combination of logic capacity, embedded memory, and I/O density in a compact 324‑LFBGA package. It is positioned for designers who need a cost‑conscious Cyclone V GX device with defined electrical and environmental limits for commercial applications.

Coupled with Cyclone V family features documented in the device overview—such as low‑power 28‑nm process technology, enhanced adaptive logic modules, and family‑level hard IP—this FPGA offers a solid platform for mid‑range embedded designs that require scalability, predictable power planning, and standard package options.

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