5CGXFC3B6U19C7N

The 5CGXFC3B6U19C7N is a Cyclone® V GX Field Programmable Gate Array (FPGA) in a 484-FBGA (484-UBGA, 19×19) package from Intel. It delivers a balanced combination of programmable logic, embedded memory, and I/O capacity for designs that require on‑chip integration and configurable interfaces.

Key device-level specifications include 31,500 logic elements, approximately 1.381 Mbits of embedded memory, 208 user I/Os, a nominal core supply range of 1.07 V to 1.13 V, and an operating temperature range of 0 °C to 85 °C. As part of the Cyclone V family, this GX device is built on TSMC's 28-nm low-power process and is enhanced for applications that benefit from integrated transceivers and hard memory controllers.

Key Features

• Core and Process  Built on TSMC 28-nm low-power (28LP) process technology with a core voltage nominally between 1.07 V and 1.13 V.
• Logic Capacity  31,500 logic elements suitable for mid-density FPGA designs and integration of custom logic functions.
• Embedded Memory  Approximately 1.381 Mbits of on-chip RAM for buffering, local storage, and embedded data structures.
• I/O and Package  208 user I/Os in a 484-FBGA (supplier package 484-UBGA, 19×19) surface-mount package to support diverse external interfaces.
• Family-level IP and Architecture  Cyclone V devices include features such as enhanced 8‑input adaptive logic modules (ALMs), variable-precision DSP blocks, integrated transceivers, and hard memory controllers as part of the family architecture.
• Operating and Supply Conditions  Commercial-grade operating temperature 0 °C to 85 °C and RoHS-compliant materials.
• Package and Mounting  Surface-mount 484-FBGA package suitable for compact board-level integration.

Typical Applications

• Wireless and Wireline Infrastructure  Used for protocol processing, packet handling, and application-specific logic where integrated transceivers and on-chip memory accelerate data paths.
• Communications Equipment  Implement PHY/MAC bridging, protocol offload, and interface adaptation leveraging the device’s I/O density and Cyclone V family transceiver and controller features.
• Embedded Systems and Controls  Mid-density programmable logic for control, sensor interfacing, and custom state machines in commercial embedded products.
• Military and Aerospace Subsystems  Employed in subsystem functions that require reprogrammable logic and integration of custom signal-processing or control functions (use per program requirements).

Unique Advantages

• Balanced Integration: Combines 31,500 logic elements with on-chip RAM and family IP blocks to reduce external component count and simplify board design.
• Low-Power Process: Built on 28-nm low-power technology to help manage system power budgets when compared to previous generation devices.
• Flexible I/O and Packaging: 208 I/Os in a compact 484-FBGA allow dense connectivity for multi-interface designs while maintaining a small board footprint.
• Commercial Temperature Range: Rated for 0 °C to 85 °C operation to match standard commercial applications and environments.
• Standards and Compliance: RoHS-compliant materials support regulatory and manufacturing requirements for lead-free assembly.

Why Choose 5CGXFC3B6U19C7N?

The 5CGXFC3B6U19C7N places Cyclone V GX family capabilities into a compact 484-FBGA package, offering a practical balance of logic density, embedded memory, and I/O for mid-range FPGA applications. Its TSMC 28-nm low-power foundation and Cyclone V family architecture deliver integration features—such as enhanced ALMs, DSP resources, and integrated transceiver/memory IP—that help shorten development cycles and reduce external BOM for commercial systems.

This device is well suited to designers and procurement teams building commercial embedded systems, communications equipment, and programmable subsystems that require a known Intel Cyclone V platform, deterministic supply-voltage range, and defined operating temperature window.

Request a quote or submit an RFQ today to discuss availability and pricing for 5CGXFC3B6U19C7N.