5CGXFC3B6U19I7N

The 5CGXFC3B6U19I7N is a Cyclone® V GX field programmable gate array (FPGA) IC from Intel, delivered in a 484‑FBGA (484‑UBGA, 19×19) surface‑mount package. It combines 31,500 logic elements with approximately 1.381 Mbits of on‑chip RAM and 208 I/Os to support complex embedded logic, memory buffering, and high‑pin‑count I/O requirements.

As a member of the Cyclone V family, this GX device inherits family-level enhancements such as integrated transceivers and hard memory controller support, targeting industrial, wireless and wireline, and military applications that require a balance of integration, I/O density, and power efficiency.

Key Features

• Logic Fabric 31,500 logic elements for configurable digital logic and control functions.
• Embedded Memory Approximately 1.381 Mbits of on‑chip RAM for buffering, lookup tables, and state storage.
• I/O Density 208 general‑purpose I/Os to support broad signal interfacing and peripheral connections.
• Package and Mounting 484‑FBGA (484‑UBGA, 19×19) package, surface mount for compact board footprints and reliable connections.
• Power Core voltage range specified at 1.07 V to 1.13 V to match tight system power budgets.
• Operating Range Industrial operating temperature from −40°C to 100°C for deployment in demanding environments.
• RoHS Compliance Environmentally compliant manufacturing specification for regulatory alignment.
• Cyclone V Family Capabilities Family‑level features include integrated transceivers and hard memory controllers (as documented for Cyclone V devices), enabling higher integration for transceiver and memory interfaces.

Typical Applications

• Industrial Control Logic consolidation, sensor interfacing, and real‑time control where extended temperature range and high I/O count are required.
• Wireless and Wireline Infrastructure Data path processing and protocol handling that benefit from a balance of logic capacity, embedded RAM, and family‑level transceiver support.
• Military and Defense Systems Ruggedized designs that require industrial temperature operation, configurable logic, and high I/O density for subsystem integration.

Unique Advantages

• Substantial Logic Capacity: 31,500 logic elements enable complex state machines, custom accelerators, and control logic on a single device.
• On‑Chip Memory: Approximately 1.381 Mbits of embedded memory reduces external memory dependence for many buffering and LUT needs.
• High I/O Count: 208 I/Os simplify board routing by accommodating numerous peripherals, sensors, and parallel interfaces directly.
• Industrial Temperature Rating: −40°C to 100°C operation supports deployments in temperature‑challenging environments.
• Compact BGA Package: 484‑FBGA (19×19) provides a dense, manufacturable footprint for space‑constrained boards.
• Low‑Voltage Core Operation: Narrow core voltage window (1.07–1.13 V) assists in predictable power budgeting and supply design.
• RoHS‑Compliant: Meets common environmental requirements for modern product assemblies.

Why Choose 5CGXFC3B6U19I7N?

The 5CGXFC3B6U19I7N delivers a practical balance of logic resources, on‑chip memory, and I/O density in a compact 484‑FBGA package, with industrial temperature capability and RoHS compliance. As part of the Cyclone V GX family, it aligns with applications that need integrated transceiver and memory controller capabilities at the device‑family level while maintaining controlled power and footprint.

This device is well suited for engineering teams targeting industrial automation, communications infrastructure, or defense systems that require configurable hardware building blocks, predictable power requirements, and a high degree of I/O connectivity.

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