5CGXFC3B6U19C6N

IC FPGA 208 I/O 484UBGA
Part Description

Cyclone® V GX Field Programmable Gate Array (FPGA) IC 208 1381376 31500 484-FBGA

Quantity 733 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package484-UBGA (19x19)GradeCommercialOperating Temperature0°C – 85°C
Package / Case484-FBGANumber of I/O208Voltage1.07 V - 1.13 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs11900Number of Logic Elements/Cells31500
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits1381376

Overview of 5CGXFC3B6U19C6N – Cyclone® V GX FPGA, 31,500 Logic Elements, 484-FBGA

The 5CGXFC3B6U19C6N is a Cyclone® V GX field programmable gate array (FPGA) in a 484-FBGA package targeted at cost-sensitive, high-volume designs. This commercial-grade device provides 31,500 logic elements, approximately 1.38 Mbits of embedded memory, and 208 user I/Os in a compact 19×19 484-UBGA footprint.

As part of the Cyclone V family, the device is built on a 28 nm low-power process and is enhanced with integrated transceivers and hard memory controller functionality, delivering a balanced combination of integration, moderate density, and energy-efficient operation for industrial, wireless/wireline, and defense applications.

Key Features

  • Core and process  Built on a 28 nm low-power process with a typical core voltage in the 1.07 V to 1.13 V range for predictable FPGA core supply requirements.
  • Programmable logic  31,500 logic elements provide programmable fabric for custom digital logic, state machines, and protocol handling.
  • Embedded memory  Approximately 1.38 Mbits of on-chip RAM to support buffering, FIFOs, and small on-chip data storage.
  • I/O and packaging  208 I/O pins in a 484-FBGA (484-UBGA, 19×19) surface-mount package for dense board-level integration.
  • Integrated system IP  Cyclone V GX devices include integrated transceivers and hard memory controller features to simplify high-speed serial links and external memory interfaces.
  • Operating conditions  Commercial-grade device with an operating temperature range of 0 °C to 85 °C.
  • RoHS compliant  Manufactured to meet RoHS requirements for environmentally conscious designs.

Typical Applications

  • Wireless and wireline communications  Use for protocol processing and interface bridging where integrated transceivers and on-chip memory accelerate data-path implementation.
  • Industrial control  Implement motor control, sensor aggregation, and machine I/O functions using the device’s logic capacity and plentiful I/Os.
  • Defense and ruggedized systems  Deploy as a moderate-density FPGA for custom digital processing and interface handling in defense-oriented equipment (commercial-grade temperature range).
  • High-volume, cost-sensitive products  Leverage Cyclone V family migration options and compact packaging for production designs that balance performance and cost.

Unique Advantages

  • Integrated transceivers and memory controllers: Reduces external component count and design complexity for high-speed and memory-backed interfaces.
  • Balanced logic and memory capacity: 31,500 logic elements paired with approximately 1.38 Mbits of embedded RAM supports diverse control and buffering needs on-chip.
  • Compact surface-mount package: 484-UBGA (19×19) footprint enables dense board layouts and simplified assembly.
  • Predictable power envelope: Narrow core voltage specification (1.07–1.13 V) aids power-supply design and system integration.
  • Commercial-grade readiness: 0 °C to 85 °C operating range and RoHS compliance for mainstream application deployment.
  • Family migration: Compatible Cyclone V family packaging and device density options support product scaling and design reuse.

Why Choose 5CGXFC3B6U19C6N?

The 5CGXFC3B6U19C6N delivers a practical combination of programmable logic, embedded memory, and integrated I/O in a compact 484-FBGA package for designers targeting commercial applications. Its inclusion in the Cyclone V GX family offers integrated transceivers and hard memory controller features while leveraging a 28 nm low-power process to help manage system power and complexity.

This part suits teams developing high-volume, cost-sensitive systems that require moderate FPGA density, on-chip memory, and multiple I/Os with a straightforward migration path across Cyclone V device densities and package options.

Request a quote or submit an inquiry to check availability and pricing for 5CGXFC3B6U19C6N. Our team can provide lead-time information and support for quantity pricing and delivery.

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