5CGXFC4C6M13C6N
| Part Description |
Cyclone® V GX Field Programmable Gate Array (FPGA) IC 175 2862080 50000 383-TFBGA |
|---|---|
| Quantity | 282 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 9 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 383-MBGA (13x13) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 383-TFBGA | Number of I/O | 175 | Voltage | 1.07 V - 1.13 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 18868 | Number of Logic Elements/Cells | 50000 | ||
| Number of Gates | N/A | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 2862080 |
Overview of 5CGXFC4C6M13C6N – Cyclone V GX FPGA, 50,000 logic elements, 383-TFBGA
The 5CGXFC4C6M13C6N is an Intel Cyclone® V GX field-programmable gate array (FPGA) in a 383-TFBGA (13×13) package, offering 50,000 logic elements and a rich I/O complement. This GX-class Cyclone V device integrates high-performance FPGA fabric with embedded memory and transceiver-capable features intended for cost-sensitive, bandwidth-focused designs.
Designed for applications such as industrial control, wireless and wireline communications, and military systems, the device delivers a balance of integration and power efficiency. It operates on a core supply range of 1.07 V to 1.13 V and a commercial temperature grade of 0 °C to 85 °C.
Key Features
- Logic Capacity — 50,000 logic elements providing substantial programmable logic resources for mid-density designs.
- Embedded Memory — Approximately 2.86 Mbits of on-chip RAM (2,862,080 bits) to support data buffering, frame storage, and local scratch memory.
- I/O Density — 175 user I/O pins suitable for wide peripheral interfacing and board-level connectivity.
- Adaptive Logic Module (ALM) — Cyclone V family ALM architecture (enhanced 8-input ALM) for flexible logic mapping and efficient resource use.
- Transceiver and System Integration — GX-class device characteristics include integrated transceiver-capable features and hard memory-controller capabilities as described in the Cyclone V device overview.
- Power — Low-voltage core operation with a specified supply range of 1.07 V to 1.13 V, supporting low-power system designs.
- Package & Mounting — 383-TFBGA (supplier package: 383-MBGA 13×13) in a surface-mount form factor for compact board layouts.
- Commercial Grade — Specified for 0 °C to 85 °C operating temperature suitable for commercial applications.
- RoHS Compliance — Device is RoHS compliant.
Typical Applications
- Industrial Control — Implement real-time motor control, sensor interfacing, and deterministic I/O aggregation using the device’s logic capacity and ample I/O.
- Wireless & Wireline Communications — Use embedded memory and transceiver-capable architecture for protocol processing, framing, and interface bridging in communications equipment.
- Defense & Military Systems — Leverage programmable logic and embedded memory for custom signal processing, interface adaptation, and system glue logic in military platforms.
- Embedded SoC and Accelerator Functions — Offload compute kernels or implement custom accelerators that require local RAM and sizable programmable logic.
Unique Advantages
- Substantial Logic Resource: 50,000 logic elements enable mid-range integration of custom logic, reducing the need for multiple discrete components.
- On-Chip Memory: Approximately 2.86 Mbits of embedded RAM reduces external memory dependence and improves latency for local data paths.
- Flexible I/O: 175 I/O pins provide broad connectivity options for sensors, peripherals, and board-level interfaces.
- Low-Voltage Operation: Narrow core-voltage range (1.07–1.13 V) supports power-optimized designs and predictable power budgeting.
- Compact Packaging: 383-TFBGA (13×13) surface-mount package supports high-density board layouts while maintaining thermal and mechanical compatibility with standard assembly.
- Commercial Readiness: Specified 0 °C to 85 °C operating temperature and RoHS compliance make the device suitable for commercial product lines.
Why Choose 5CGXFC4C6M13C6N?
The 5CGXFC4C6M13C6N Cyclone V GX FPGA combines a mid-density logic fabric with meaningful on-chip memory and broad I/O in a compact 383-TFBGA package. Its low-voltage operation and Cyclone V family architecture provide a strong foundation for designers targeting cost- and power-sensitive applications that still require programmable flexibility and embedded memory.
This device is well suited to teams building industrial systems, communications equipment, or defense platforms that need a balance of integration, predictable power characteristics, and a commercially rated temperature range. The Cyclone V family documentation outlines architecture advantages such as ALM structure and embedded memory types that can help accelerate design mapping and optimization.
If you would like pricing, availability, or a formal quote for 5CGXFC4C6M13C6N, submit a quote request or sales inquiry and a representative will provide current lead times and ordering information.

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