5CGXFC4C6U19A7N

IC FPGA 224 I/O 484UBGA
Part Description

Cyclone® V GX Field Programmable Gate Array (FPGA) IC 224 2862080 50000 484-FBGA

Quantity 576 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package484-UBGA (19x19)GradeAutomotiveOperating Temperature-40°C – 125°C
Package / Case484-FBGANumber of I/O224Voltage1.07 V - 1.13 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs18868Number of Logic Elements/Cells50000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationAEC-Q100Total RAM Bits2862080

Overview of 5CGXFC4C6U19A7N – Cyclone V GX FPGA, 50,000 Logic Elements, 224 I/O, 484-FBGA

The 5CGXFC4C6U19A7N is a Cyclone® V GX field-programmable gate array (FPGA) in a 484-FBGA package. It delivers a combination of programmable logic, embedded memory and integrated transceiver/memory controller functionality targeted at applications across automotive, industrial, wireless/wireline and military markets.

Built on TSMC's 28‑nm low‑power (28LP) process with a nominal 1.1 V core, this device provides a balanced platform for designs that require sizable logic and memory resources, extensive I/O, and operation across an extended temperature range.

Key Features

  • Logic Capacity — Approximately 50,000 logic elements to implement complex control, signal processing and glue-logic functions.
  • Embedded Memory — Approximately 2.86 Mbits of on-chip RAM to support buffering, state storage and local data manipulation.
  • I/O Count — 224 programmable I/O pins for flexible interfacing to sensors, peripherals, external memory and transceivers.
  • Process and Core Voltage — Fabricated on TSMC 28‑nm low‑power technology with a core supply range of 1.07 V to 1.13 V (nominal 1.1 V).
  • Automotive Qualification — Grade: Automotive with AEC‑Q100 qualification for use in applications requiring automotive qualification.
  • Extended Temperature Range — Rated for operation from −40 °C to 125 °C, supporting environments with wide thermal variation.
  • On‑Device Architecture — Cyclone V family features such as enhanced 8‑input adaptive logic modules (ALMs), M10K embedded memory blocks with ECC, and integrated hard memory controllers and transceivers are part of the device family architecture.
  • Package and Mounting — 484‑FBGA (supplier device package: 484‑UBGA, 19 × 19) in a surface‑mount form factor suitable for compact system assemblies.
  • Standards and Compliance — RoHS‑compliant material declarations for regulatory alignment.

Typical Applications

  • Automotive Systems — Engine, body and ADAS subsystems requiring components qualified to AEC‑Q100 and an extended temperature range.
  • Industrial Equipment — Control and automation systems needing programmable logic, significant embedded memory and wide operating temperatures.
  • Wireless and Wireline Infrastructure — Network and communications equipment that benefit from integrated transceivers, hard memory controllers and programmable fabric.
  • Military and Ruggedized Electronics — Applications that require qualified components capable of extended temperature operation and robust packaging.

Unique Advantages

  • Automotive‑grade Qualification: AEC‑Q100 qualification identifies this device for automotive applications that demand validated component reliability.
  • Substantial Logic and Memory Resource: Roughly 50,000 logic elements combined with ~2.86 Mbits of embedded RAM support complex logic, buffering and moderate on‑chip data processing.
  • High I/O Density: 224 I/O pins enable broad interfacing options without external I/O expanders, simplifying system design.
  • Low‑Voltage Core: Narrow core supply range (1.07 V–1.13 V) consistent with 28‑nm low‑power process operation for predictable power design.
  • Robust Packaging for Compact Boards: 484‑FBGA (484‑UBGA, 19×19) surface‑mount package balances pin count and PCB footprint for space‑constrained applications.
  • Family-Level Integration: Cyclone V family features such as enhanced ALMs, M10K blocks with ECC, hard memory controllers and integrated transceivers provide a versatile platform for mixed signal, memory and high‑bandwidth designs.

Why Choose 5CGXFC4C6U19A7N?

The 5CGXFC4C6U19A7N positions itself as a capable, automotive‑qualified Cyclone V GX FPGA that brings together significant logic density, embedded memory and high I/O count in a compact 484‑FBGA package. Its 28‑nm low‑power heritage and narrow core voltage range facilitate predictable integration into systems with stringent power and thermal requirements.

This device is suitable for teams designing automotive, industrial, communications or military systems that need a qualified, mid‑density FPGA with on‑chip memory, extensive I/O and family‑level architectural features that simplify implementation of controllers, interfaces and data paths.

Request a quote or submit an inquiry to receive pricing and availability information for part number 5CGXFC4C6U19A7N.

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