5CGXFC4C6M13C7N

IC FPGA 175 I/O 383MBGA
Part Description

Cyclone® V GX Field Programmable Gate Array (FPGA) IC 175 2862080 50000 383-TFBGA

Quantity 379 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package383-MBGA (13x13)GradeCommercialOperating Temperature0°C – 85°C
Package / Case383-TFBGANumber of I/O175Voltage1.07 V - 1.13 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs18868Number of Logic Elements/Cells50000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits2862080

Overview of 5CGXFC4C6M13C7N – Cyclone® V GX FPGA, 50,000 Logic Elements, ~2.86 Mbits RAM, 175 I/O, 383-TFBGA

The 5CGXFC4C6M13C7N is a Cyclone V GX field programmable gate array (FPGA) IC from Intel. This device provides a mid-range FPGA fabric with approximately 50,000 logic elements, roughly 2.86 Mbits of embedded memory, and up to 175 I/O pins in a 383-TFBGA surface-mount package. It targets applications that require a balance of integration, I/O density, and power-efficient core operation.

As part of the Cyclone V family, the device benefits from the series' low-power architecture and embedded logic/memory primitives suited for industrial control, communications, and defense-oriented signal processing tasks.

Key Features

  • Logic Capacity  Approximately 50,000 logic elements to implement mid-density FPGA designs and custom logic functions.
  • Embedded Memory  Approximately 2.86 Mbits of on-chip RAM for buffering, packet buffering, and local data storage.
  • I/O Density  Up to 175 user I/O pins to interface with external peripherals, memory devices, and high-pin-count subsystems.
  • Power and Core Voltage  Core supply range specified at 1.07 V to 1.13 V for low-voltage system integration and power-sensitive designs.
  • Package and Mounting  383-TFBGA package (supplier package: 383-MBGA, 13 × 13 mm) with surface-mount termination for compact board layouts.
  • Operating Range and Grade  Commercial-grade device specified for 0 °C to 85 °C ambient operation.
  • RoHS Compliance  RoHS-compliant manufacturing status for environmentally conscious designs.
  • Cyclone V Family Capabilities  Benefits from Cyclone V architecture such as 28 nm low-power process technology, enhanced ALM logic, embedded memory blocks, and variable-precision DSP resources as part of the device family feature set.

Typical Applications

  • Industrial Control  Implement motor control, PLC logic, and sensor aggregation using the device's logic capacity and on-chip RAM for deterministic local processing.
  • Wireless and Wireline Infrastructure  Use the FPGA fabric and I/O density for protocol bridging, packet handling, and control-plane logic in communications equipment.
  • Defense and Test Systems  Deploy the device for signal processing building blocks, data acquisition front-ends, and custom I/O handling where reprogrammability is required.
  • Embedded Compute and Prototyping  Leverage the combination of logic, embedded memory, and flexible I/O for system prototyping and embedded acceleration tasks.

Unique Advantages

  • Balanced Logic and Memory  Approximately 50k logic elements paired with ~2.86 Mbits of embedded RAM enables complex control and buffering without immediate need for external memory.
  • High I/O Count  175 I/O pins provide direct connectivity to multiple peripherals and interfaces, reducing the need for additional glue logic.
  • Low-Voltage Operation  Narrow core voltage range (1.07 V–1.13 V) supports tight power-management requirements in energy-conscious designs.
  • Compact Surface-Mount Package  383-TFBGA (13 × 13 mm supplier package) enables a small board footprint for space-constrained applications.
  • Commercial Temperature Suitability  Specified for 0 °C to 85 °C operation, matching commercial product and development environments.
  • RoHS Compliance  Environmentally compliant construction simplifies regulatory alignment for many markets.

Why Choose 5CGXFC4C6M13C7N?

The 5CGXFC4C6M13C7N delivers a pragmatic mix of logic capacity, embedded memory, and I/O resources in a compact surface-mount package, making it well suited for mid-density FPGA deployments. It combines the Cyclone V family’s low-power architecture and silicon-level features with specific device-level specifications that address commercial embedded systems and communications equipment.

Designers seeking a reprogrammable, mid-range FPGA with a controlled core-voltage window, substantial I/O, and RoHS compliance will find this device appropriate for applications where integration, board-area efficiency, and power-aware operation matter. Its alignment with the Cyclone V device family also supports migration and scalable design choices within the same product family.

If you require pricing, availability, or a formal quote for 5CGXFC4C6M13C7N, submit a request to receive sales and ordering information tailored to your project timeline and volume needs.

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