5CGXFC4C6M13C7N
| Part Description |
Cyclone® V GX Field Programmable Gate Array (FPGA) IC 175 2862080 50000 383-TFBGA |
|---|---|
| Quantity | 379 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 383-MBGA (13x13) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 383-TFBGA | Number of I/O | 175 | Voltage | 1.07 V - 1.13 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 18868 | Number of Logic Elements/Cells | 50000 | ||
| Number of Gates | N/A | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 2862080 |
Overview of 5CGXFC4C6M13C7N – Cyclone® V GX FPGA, 50,000 Logic Elements, ~2.86 Mbits RAM, 175 I/O, 383-TFBGA
The 5CGXFC4C6M13C7N is a Cyclone V GX field programmable gate array (FPGA) IC from Intel. This device provides a mid-range FPGA fabric with approximately 50,000 logic elements, roughly 2.86 Mbits of embedded memory, and up to 175 I/O pins in a 383-TFBGA surface-mount package. It targets applications that require a balance of integration, I/O density, and power-efficient core operation.
As part of the Cyclone V family, the device benefits from the series' low-power architecture and embedded logic/memory primitives suited for industrial control, communications, and defense-oriented signal processing tasks.
Key Features
- Logic Capacity Approximately 50,000 logic elements to implement mid-density FPGA designs and custom logic functions.
- Embedded Memory Approximately 2.86 Mbits of on-chip RAM for buffering, packet buffering, and local data storage.
- I/O Density Up to 175 user I/O pins to interface with external peripherals, memory devices, and high-pin-count subsystems.
- Power and Core Voltage Core supply range specified at 1.07 V to 1.13 V for low-voltage system integration and power-sensitive designs.
- Package and Mounting 383-TFBGA package (supplier package: 383-MBGA, 13 × 13 mm) with surface-mount termination for compact board layouts.
- Operating Range and Grade Commercial-grade device specified for 0 °C to 85 °C ambient operation.
- RoHS Compliance RoHS-compliant manufacturing status for environmentally conscious designs.
- Cyclone V Family Capabilities Benefits from Cyclone V architecture such as 28 nm low-power process technology, enhanced ALM logic, embedded memory blocks, and variable-precision DSP resources as part of the device family feature set.
Typical Applications
- Industrial Control Implement motor control, PLC logic, and sensor aggregation using the device's logic capacity and on-chip RAM for deterministic local processing.
- Wireless and Wireline Infrastructure Use the FPGA fabric and I/O density for protocol bridging, packet handling, and control-plane logic in communications equipment.
- Defense and Test Systems Deploy the device for signal processing building blocks, data acquisition front-ends, and custom I/O handling where reprogrammability is required.
- Embedded Compute and Prototyping Leverage the combination of logic, embedded memory, and flexible I/O for system prototyping and embedded acceleration tasks.
Unique Advantages
- Balanced Logic and Memory Approximately 50k logic elements paired with ~2.86 Mbits of embedded RAM enables complex control and buffering without immediate need for external memory.
- High I/O Count 175 I/O pins provide direct connectivity to multiple peripherals and interfaces, reducing the need for additional glue logic.
- Low-Voltage Operation Narrow core voltage range (1.07 V–1.13 V) supports tight power-management requirements in energy-conscious designs.
- Compact Surface-Mount Package 383-TFBGA (13 × 13 mm supplier package) enables a small board footprint for space-constrained applications.
- Commercial Temperature Suitability Specified for 0 °C to 85 °C operation, matching commercial product and development environments.
- RoHS Compliance Environmentally compliant construction simplifies regulatory alignment for many markets.
Why Choose 5CGXFC4C6M13C7N?
The 5CGXFC4C6M13C7N delivers a pragmatic mix of logic capacity, embedded memory, and I/O resources in a compact surface-mount package, making it well suited for mid-density FPGA deployments. It combines the Cyclone V family’s low-power architecture and silicon-level features with specific device-level specifications that address commercial embedded systems and communications equipment.
Designers seeking a reprogrammable, mid-range FPGA with a controlled core-voltage window, substantial I/O, and RoHS compliance will find this device appropriate for applications where integration, board-area efficiency, and power-aware operation matter. Its alignment with the Cyclone V device family also supports migration and scalable design choices within the same product family.
If you require pricing, availability, or a formal quote for 5CGXFC4C6M13C7N, submit a request to receive sales and ordering information tailored to your project timeline and volume needs.

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