5CGXFC4C6F27C7N

The 5CGXFC4C6F27C7N is an Intel Cyclone V GX field programmable gate array (FPGA) packaged in a 672-ball BGA (672-FBGA, 27×27). It provides 50,000 logic elements, approximately 2.86 Mbits of embedded memory, and 336 I/Os in a surface-mount commercial-grade package.

Built around the Cyclone V family architecture, this device targets applications that require a balance of integration, I/O density, and low-power operation — for example, industrial systems, wireless/wireline interfaces, and embedded logic-intensive designs.

Key Features

• Logic Density – 50,000 logic elements to implement complex control, signal processing, and glue-logic functions.
• Embedded Memory – Approximately 2.86 Mbits of on-chip RAM for look-up tables, buffering, and small shared data stores.
• I/O Capacity – 336 user I/O pins suitable for multi-channel interfaces and dense peripheral connections.
• Enhanced ALM Architecture – Cyclone V family enhanced 8-input adaptive logic modules (ALMs) for efficient logic implementation (series-level feature).
• Integrated High-Speed Blocks – Series features include integrated transceivers and hard memory controllers to simplify high-bandwidth interfaces and external memory integration.
• Core Voltage – Specified operating core supply range of 1.07 V to 1.13 V (nominal 1.1 V).
• Package & Mounting – 672-BGA (supplier device package: 672-FBGA 27×27) in a surface-mount format for compact system integration.
• Operating Range & Grade – Commercial grade with an operating temperature range of 0 °C to 85 °C and RoHS compliance.

Typical Applications

• Industrial Control – Implement real-time control logic, sensor aggregation, and deterministic I/O handling using abundant logic elements and 336 I/Os.
• Wireless and Wireline Interfaces – Use integrated transceiver and hard IP capabilities (series features) for protocol bridging, framing, and data transport tasks.
• Embedded System Logic – Offload custom data paths, glue logic, and peripheral interfaces in space-constrained boards using the 672-BGA package.

Unique Advantages

• Balanced Logic and Memory – 50,000 logic elements combined with approximately 2.86 Mbits of embedded memory help implement medium-complexity designs without immediate external memory.
• High I/O Density – 336 I/Os enable multiple parallel interfaces and high pin-count subsystems without large packages.
• Compact, Surface-Mount Package – 672-FBGA (27×27) allows dense PCB integration while keeping the board footprint efficient.
• Controlled Core Supply – Tight 1.07 V–1.13 V core voltage specification supports predictable power design and margining.
• Series-Level Integration – Cyclone V family features such as enhanced ALMs, integrated transceivers, and hard memory controllers reduce external component count for targeted high-bandwidth designs.
• Commercial-Grade Reliability – RoHS-compliant, commercial-grade device suitable for standard temperature-range applications (0 °C to 85 °C).

Why Choose 5CGXFC4C6F27C7N?

The 5CGXFC4C6F27C7N delivers a practical balance of logic capacity, embedded RAM, and I/O count in a compact 672-BGA package, making it well suited for designers who need mid-range FPGA resources with series-level integration features. Its controlled core voltage and commercial operating range simplify power and thermal planning for volume products and prototypes alike.

This Cyclone V GX device is appropriate for embedded-system integrators and OEMs seeking a cost-conscious FPGA solution with built-in capabilities to support protocol interfaces and compact board layouts, while leveraging the Cyclone V family feature set for predictable system-level integration.

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