5CGXFC4C6M13I7N
| Part Description |
Cyclone® V GX Field Programmable Gate Array (FPGA) IC 175 2862080 50000 383-TFBGA |
|---|---|
| Quantity | 151 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 383-MBGA (13x13) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 383-TFBGA | Number of I/O | 175 | Voltage | 1.07 V - 1.13 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 18868 | Number of Logic Elements/Cells | 50000 | ||
| Number of Gates | N/A | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 2862080 |
Overview of 5CGXFC4C6M13I7N – Cyclone® V GX FPGA, 50,000 logic elements, 383-TFBGA
The 5CGXFC4C6M13I7N is a Cyclone V GX Field Programmable Gate Array (FPGA) IC in a 383-TFBGA (383-MBGA 13×13) surface-mount package. It delivers a balance of programmable logic, on-chip embedded memory, and I/O capacity for industrial and communications applications.
Built on the Cyclone V device family foundation, this device targets cost- and power-sensitive systems where integration, deterministic performance, and industrial temperature operation are required.
Key Features
- Logic — Approximately 50,000 logic elements for implementing mid-density FPGA designs with enhanced 8-input adaptive logic modules (ALMs) as part of the Cyclone V architecture.
- Embedded Memory — Approximately 2.86 Mbits of on-chip RAM (2,862,080 total RAM bits) organized in the Cyclone V memory architecture, which supports M10K memory blocks with ECC in the device family.
- Process and Core Voltage — Part of the Cyclone V family built on TSMC 28 nm low-power (28LP) process technology with a nominal 1.1 V core; device supply range 1.07 V to 1.13 V.
- I/O and Packaging — 175 user I/Os in a 383-TFBGA (supplier package: 383-MBGA 13×13) surface-mount package for compact board-level integration.
- Thermal and Grade — Industrial-grade operation with an operating temperature range of −40 °C to 100 °C and RoHS-compliant construction.
- Family-Level Integration — Cyclone V devices are enhanced with integrated transceivers and hard memory controllers and include variable-precision DSP blocks and hard IP options across the family.
- Power Efficiency — Cyclone V family-level improvements are designed for reduced power consumption compared to prior generations, supporting low-power system designs.
Typical Applications
- Industrial Control and Automation — Mid-density FPGA fabric, industrial temperature rating, and robust I/O count support control logic, deterministic I/O handling, and local processing in factory and process automation equipment.
- Wireless and Wireline Infrastructure — Family-level transceiver and DSP capabilities, coupled with programmable logic and embedded memory, suit tasks such as protocol processing, framing, and packet buffering in communications equipment.
- Defense and Ruggedized Systems — Industrial-grade temperature range and field-programmable flexibility make the device appropriate for military and rugged applications that require reprogrammable logic and embedded memory.
Unique Advantages
- Balanced Integration: Combines ~50,000 logic elements with approximately 2.86 Mbits of embedded memory and 175 I/Os in a compact 383-TFBGA package, reducing board-level BOM and footprint.
- Low-Power Foundation: Built on a 28 nm low-power process with a 1.1 V core and a narrow supply range (1.07–1.13 V), enabling power-optimized designs.
- Industrial Reliability: Specified for −40 °C to 100 °C operation and RoHS-compliant construction for long-term use in industrial environments.
- Family-Level IP and Peripherals: Leverages Cyclone V family features such as adaptive logic modules, M10K memory blocks with ECC, variable-precision DSP blocks, and integrated transceiver and memory-controller options to accelerate system design.
- Compact Surface-Mount Packaging: 383-MBGA (13×13) surface-mount package simplifies placement on modern PCB designs while providing substantial I/O.
Why Choose 5CGXFC4C6M13I7N?
The 5CGXFC4C6M13I7N positions itself as a mid-density Cyclone V GX FPGA that combines programmable logic, embedded RAM, and significant I/O in an industrial-grade, surface-mount package. Its 1.07–1.13 V supply range, industrial temperature rating, and family-level low-power architecture make it suited to engineers designing cost- and power-conscious embedded systems in industrial, wireless/wireline, and defense markets.
Designers can leverage the Cyclone V device family features—enhanced ALMs, DSP capabilities, and embedded memory structures—to implement signal processing, control logic, and buffering while maintaining a compact BOM and board footprint.
Request a quote or submit an inquiry to receive pricing, availability, and lead-time information for the 5CGXFC4C6M13I7N.

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