5CGXFC4C6F27I7N

IC FPGA 336 I/O 672FBGA
Part Description

Cyclone® V GX Field Programmable Gate Array (FPGA) IC 336 2862080 50000 672-BGA

Quantity 1,035 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package672-FBGA (27x27)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case672-BGANumber of I/O336Voltage1.07 V - 1.13 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs18868Number of Logic Elements/Cells50000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits2862080

Overview of 5CGXFC4C6F27I7N – Cyclone® V GX FPGA, 50,000 Logic Elements, 672-BGA

The 5CGXFC4C6F27I7N is an Intel Cyclone V GX field-programmable gate array (FPGA) in a 672-BGA package optimized for industrial designs. It combines a mid-range logic capacity with on-chip embedded memory and a broad I/O count to support bandwidth-focused, cost-sensitive applications.

Designed for use in industrial, wireless and wireline, and military markets, this Cyclone V device family emphasizes lower power operation, integrated transceivers and hard memory controllers to address increasing bandwidth and integration requirements.

Key Features

  • Logic Capacity Approximately 50,000 logic elements to implement mid-density FPGA designs.
  • Embedded Memory Approximately 2.86 Mbits of embedded memory (2,862,080 bits) for on-chip buffering and storage.
  • I/O 336 user I/O pins to support parallel interfaces and multiple peripheral connections.
  • Transceivers and Memory IP Cyclone V family enhancements include integrated transceivers and hard memory controllers for high-bandwidth external interfaces.
  • Process and Power Built on TSMC's 28-nm low-power (28LP) process technology with a core supply range of 1.07 V to 1.13 V and a typical 1.1 V core target, enabling lower overall device power consumption.
  • Package and Mounting 672-BGA package (672-FBGA, 27×27) designed for surface-mount assembly.
  • Operating Range Industrial-grade operation from −40 °C to 100 °C and RoHS-compliant.

Typical Applications

  • Industrial Control FPGA logic and ample I/O make it suitable for motor control, PLC interfaces and sensor aggregation in industrial environments within the specified temperature range.
  • Wireless and Wireline Infrastructure Integrated transceivers and hard memory controllers support high-bandwidth interface functions and protocol offload in communication equipment.
  • Defense and Rugged Systems Mid-density logic, embedded memory and industrial temperature grading support signal processing and I/O-centric subsystems used in military applications.

Unique Advantages

  • Balanced Mid-Range Capacity: ~50,000 logic elements provide a trade-off between density and cost for volume-sensitive designs.
  • Integrated Bandwidth Features: Family-level support for integrated transceivers and hard memory controllers simplifies high-throughput interface implementations.
  • Low-Power Process: TSMC 28LP-based device architecture and a narrow core voltage range help reduce system power compared with earlier generations.
  • Industrial Temperature Rating: Specified operation from −40 °C to 100 °C for deployment in temperature-demanding environments.
  • High I/O Count: 336 I/O pins enable flexible system partitioning and extensive peripheral connectivity without external GPIO expanders.
  • Compact, Surface-Mount Package: 672-FBGA (27×27) package supports dense board layouts while maintaining robust signal routing.

Why Choose 5CGXFC4C6F27I7N?

The 5CGXFC4C6F27I7N Cyclone V GX FPGA delivers a balanced combination of logic capacity, embedded memory, and I/O resources in a surface-mount 672-BGA package suitable for industrial-class applications. Its 28-nm low-power architecture and family-level integration of transceivers and hard memory controllers help developers meet bandwidth and power targets while controlling system cost.

This device is well suited for engineers building mid-density FPGA designs that require a mix of on-chip memory, significant I/O, and industrial temperature operation, and it is supported by Intel device documentation and standard warranty provisions.

Request a quote or submit an inquiry to begin procurement and evaluate 5CGXFC4C6F27I7N for your next design.

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