5CGXFC3B6F23I7N

IC FPGA 208 I/O 484FBGA
Part Description

Cyclone® V GX Field Programmable Gate Array (FPGA) IC 208 1381376 31500 484-BGA

Quantity 119 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package484-FBGA (23x23)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case484-BGANumber of I/O208Voltage1.07 V - 1.13 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs11900Number of Logic Elements/Cells31500
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits1381376

Overview of 5CGXFC3B6F23I7N – Cyclone® V GX Field Programmable Gate Array (FPGA) IC 208 1381376 31500 484-BGA

The 5CGXFC3B6F23I7N is an Intel Cyclone® V GX family FPGA in a 484-BGA package, delivering a balance of integration, I/O density, and configurable logic for industrial applications. This device provides 31,500 logic elements, approximately 1.38 Mbits of embedded memory, and 208 user I/Os in a surface-mount 484‑FBGA (23×23) footprint.

Built for systems that require low-power FPGA fabric with integrated high-speed features, the Cyclone V series architecture emphasizes reduced power, integrated transceivers and hard memory controllers, and industry-focused operating ranges suitable for industrial deployments.

Key Features

  • Logic Fabric  31,500 logic elements provide programmable capacity for glue logic, protocol processing, and custom accelerators.
  • On-chip Memory  Approximately 1.38 Mbits of embedded RAM to support FIFOs, buffers, and small on-chip data stores.
  • I/O Density  208 user I/Os support dense external device interfacing and flexible board-level connectivity.
  • Process and Core Voltage  Cyclone V family devices are built on a 28‑nm low‑power process and this part operates within a 1.07 V to 1.13 V supply range (nominal 1.1 V core).
  • Integrated High‑Speed Features  Family-level features include integrated transceivers and hard memory controller IP to simplify high‑bandwidth interfaces (as described in the Cyclone V device documentation).
  • Package and Mounting  Surface-mount 484‑BGA (supplier package: 484‑FBGA, 23×23) for compact board designs.
  • Industrial Grade Temperature Range  Rated for operation from −40 °C to 100 °C for use in industrial environments.
  • Standards and Compliance  RoHS compliant.

Typical Applications

  • Industrial Automation  Implement motor control logic, sensor aggregation, and deterministic I/O handling using the device’s logic capacity and 208 I/Os within industrial temperature ranges.
  • Wireless and Wireline Infrastructure  Use the Cyclone V GX device to implement protocol offload, framing, and interface bridging where integrated transceivers and hard memory controllers are beneficial.
  • Defense and Aerospace Systems  Deploy for signal processing, data routing, and I/O expansion in systems that require industrial temperature operation and rugged surface-mount packaging.

Unique Advantages

  • Balanced Integration: Combines 31,500 logic elements with embedded memory and high I/O count to reduce external components and simplify system design.
  • Low-Core Voltage Operation: Operates within a 1.07 V to 1.13 V supply window (nominal 1.1 V), aligning with low-power system requirements.
  • Industrial Temperature Rating: −40 °C to 100 °C operating range supports deployment in temperature-challenging environments.
  • Compact BGA Package: 484‑FBGA (23×23) delivers high density in a standard surface-mount form factor for space-constrained PCBs.
  • RoHS Compliance: Environmentally compliant manufacturing supports regulatory and procurement requirements.

Why Choose 5CGXFC3B6F23I7N?

The 5CGXFC3B6F23I7N positions itself as a practical, industrial-grade FPGA option within the Cyclone V GX family, offering a mix of programmable logic, embedded memory, and substantial I/O capability in a compact 484‑BGA package. Its voltage and temperature ratings make it suitable for embedded and industrial designs that demand reliable operation across extended temperature ranges.

Designers and system engineers seeking a cost-effective, integrated FPGA solution with family-level support for high-speed interfaces and memory controllers will find this device appropriate for mid-density logic implementations, control functions, and protocol handling where board space and power efficiency are important.

If you would like pricing, availability, or a formal quotation for 5CGXFC3B6F23I7N, request a quote or submit a purchase inquiry through your preferred procurement channel.

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