5CGXFC3B6F23C6N

The 5CGXFC3B6F23C6N is an Intel Cyclone V GX field-programmable gate array optimized for cost- and power-sensitive, bandwidth-demanding embedded designs. Built on the Cyclone V device family architecture, it combines a mid-range logic capacity with on-chip memory and a broad I/O complement for flexible system integration.

Designed to address shrinking power, cost, and time-to-market pressures, this commercial-grade device targets high-volume embedded applications that require balanced logic, memory, and I/O resources while operating within a 1.07 V to 1.13 V supply range and a 0 °C to 85 °C operating window.

Key Features

• Logic Capacity — 31,500 logic elements that enable medium-complexity FPGA designs and custom digital processing.
• Embedded Memory — Approximately 1.38 Mbits of on-chip RAM for frame buffering, LUT-based storage, and small data caching.
• I/O and Packaging — 208 device I/Os in a compact 484-FBGA (23 × 23) package, surface-mountable for dense board-level integration.
• Low-Voltage Core — Device supply specified from 1.07 V to 1.13 V, matching the Cyclone V family’s 1.1 V core design approach for reduced power consumption.
• Commercial Temperature Range — Rated for 0 °C to 85 °C operation to suit standard commercial-environment deployments.
• Series-level Hard IP and Fabric Features — Cyclone V family enhancements such as 8-input adaptive logic modules, variable-precision DSP blocks, integrated transceivers, and hard memory controllers (series features documented in the Cyclone V device overview).
• Regulatory — RoHS-compliant formulation for environmental compliance in mainstream designs.

Typical Applications

• Wireless and Wireline Communications — Use integrated Cyclone V GX series transceiver and logic resources for protocol processing, packet handling, and front-end data aggregation.
• Embedded Signal Processing — Leverage the logic elements and variable-precision DSP capabilities for filtering, encoding/decoding, and real-time data manipulation.
• Memory Interface and Bridging — Implement controllers and interface logic using on-chip memory and hard memory-controller features to manage external memory subsystems.
• High-density I/O Systems — Route and manage multiple parallel interfaces and sensor streams with 208 available I/Os in a compact BGA package.

Unique Advantages

• Balanced Logic and Memory — 31,500 logic elements paired with approximately 1.38 Mbits embedded memory provides a flexible resource mix for mid-range FPGA applications.
• Compact, Board-friendly Package — 484-FBGA (23 × 23) surface-mount package enables high-density PCB layouts while maintaining a large I/O count.
• Low-Voltage Operation — Narrow supply window (1.07–1.13 V) aligned with the Cyclone V family’s low-power 1.1 V core, helping reduce system power draw.
• Series-level Fabric Enhancements — Cyclone V architectural features such as enhanced ALMs, DSP blocks, transceivers, and memory-controller hard IP simplify common communication and signal-processing functions.
• RoHS Compliance — Environmentally compliant manufacturing status for mainstream product lines and supply chains.

Why Choose 5CGXFC3B6F23C6N?

The 5CGXFC3B6F23C6N provides a practical balance of logic density, embedded memory, and I/O count in a compact 484-FBGA package, targeted at commercial embedded designs that require efficient power use and reliable board-level integration. Its specifications—31,500 logic elements, approximately 1.38 Mbits of on-chip RAM, 208 I/Os, and a tight core supply range—make it well suited for mid-range communications, signal processing, and interface-heavy subsystems.

Choosing this Cyclone V GX device gives design teams access to the Cyclone V family’s architectural benefits (including enhanced ALMs, DSP blocks, and hard memory/transceiver IP) while maintaining a small BOM footprint and RoHS compliance for volume applications.

Request a quote or submit a request for pricing and availability for part number 5CGXFC3B6F23C6N to move your design forward.