5CGXBC9E6F31C7N

IC FPGA 480 I/O 896FBGA
Part Description

Cyclone® V GX Field Programmable Gate Array (FPGA) IC 480 14251008 301000 896-BGA

Quantity 1,736 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package896-FBGA (31x31)GradeCommercialOperating Temperature0°C – 85°C
Package / Case896-BGANumber of I/O480Voltage1.07 V - 1.13 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs113560Number of Logic Elements/Cells301000
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits14251008

Overview of 5CGXBC9E6F31C7N – Cyclone® V GX FPGA, 301,000 logic elements, 896-BGA

The 5CGXBC9E6F31C7N is an Intel Cyclone® V GX field programmable gate array (FPGA) in a 896-BGA (896-FBGA 31×31) package. It combines high logic density and embedded memory with integrated transceivers and hard memory controller IP to address bandwidth‑focused and cost‑sensitive designs.

Targeted for commercial applications such as industrial systems, wireless and wireline communications, and military equipment, this device delivers a balance of performance, integration, and power efficiency within a commercial temperature range.

Key Features

  • Logic Density  Approximately 301,000 logic elements to implement complex control, signal-processing, and protocol logic.
  • Embedded Memory  Approximately 13.59 Mbits of on‑chip embedded memory for buffering, packet storage, and local data structures.
  • I/O and Packaging  480 general-purpose I/O pins in a 896-BGA (supplier: 896-FBGA 31×31) surface-mount package for high pin-count system interfaces.
  • Integrated High‑Speed IP  Part of the Cyclone V GX family enhanced with integrated transceivers and hard memory controllers to support high-bandwidth external interfaces.
  • Process and Core Voltage  Built on TSMC 28‑nm low‑power technology with an operating core supply range of 1.07 V to 1.13 V (typical 1.1 V behavior reported for the family).
  • Operating Conditions  Commercial grade device rated for 0 °C to 85 °C ambient operation.
  • Mounting & Compliance  Surface-mount device that is RoHS compliant for environmentally conscious manufacturing.

Typical Applications

  • Industrial Automation  Implement motor control, sensor aggregation, and deterministic I/O handling using abundant logic and on‑chip RAM.
  • Wireless and Wireline Communications  Use integrated transceivers and hard memory controllers to support protocol processing, framing, and high‑speed link interfaces.
  • High‑Performance Embedded Systems  Deploy as the programmable fabric in SoC or FPGA‑centric designs that require large logic capacity and substantial local memory.
  • Military and Defense Electronics  Apply the device in communication and signal-processing subsystems where high logic density and integrated transceiver capability are required.

Unique Advantages

  • High integration density: Approximately 301,000 logic elements enable complex designs without immediate need for external glue logic.
  • Substantial on‑chip memory: Roughly 13.59 Mbits of embedded RAM simplifies buffering and temporary storage for high-throughput tasks.
  • Large I/O capacity: 480 I/O pins in a 896‑FBGA package accommodate extensive peripheral and bus connections.
  • Integrated high‑speed interfaces: Cyclone V GX family features integrated transceivers and hard memory controllers to streamline high‑bandwidth system design.
  • Predictable power profile: Narrow core supply range (1.07–1.13 V) supports precise power budgeting and system-level thermal planning.
  • Commercial readiness and compliance: Surface-mount, RoHS‑compliant package rated for standard commercial temperatures for mainstream production environments.

Why Choose 5CGXBC9E6F31C7N?

The 5CGXBC9E6F31C7N positions itself as a highly integrated, commercially rated Cyclone V GX FPGA suitable for designs that require substantial logic capacity, meaningful on‑chip memory, and robust I/O. Its family-level features—integrated transceivers and hard memory controllers—help simplify board design and accelerate time-to-market for bandwidth-sensitive applications.

Engineers and procurement teams will find this device appropriate for systems where commercial temperature operation, RoHS compliance, and a compact 896‑FBGA footprint are required. The part is supported by Cyclone V device documentation and datasheets from the manufacturer to aid design and qualification efforts.

Request a quote or submit an inquiry to check pricing, availability, and lead times for 5CGXBC9E6F31C7N.

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