5CGXBC9D6F27C7N
| Part Description |
Cyclone® V GX Field Programmable Gate Array (FPGA) IC 336 14251008 301000 672-BGA |
|---|---|
| Quantity | 805 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 672-FBGA (27x27) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 672-BGA | Number of I/O | 336 | Voltage | 1.07 V - 1.13 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 113560 | Number of Logic Elements/Cells | 301000 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 14251008 |
Overview of 5CGXBC9D6F27C7N – Cyclone® V GX Field Programmable Gate Array (FPGA) IC
The Intel Cyclone® V GX FPGA 5CGXBC9D6F27C7N is a mid-to-high density programmable logic device built on the Cyclone V GX family architecture. It pairs a large FPGA fabric with integrated features from the Cyclone V series to address demanding bandwidth and integration requirements in commercial designs.
Key capabilities of this device include 301,000 logic elements, approximately 14.25 Mbits of embedded memory, 336 I/Os, and advanced packaging in a 672‑BGA (672‑FBGA, 27×27) surface‑mount package. The device operates from a core supply range of 1.07 V to 1.13 V and is specified for commercial temperature operation (0 °C to 85 °C).
Key Features
- Logic Density 301,000 logic elements for complex FPGA designs and high gate-count implementations.
- Embedded Memory Approximately 14.25 Mbits of on‑chip RAM to support buffering, lookup tables, and soft memory structures.
- I/O Count 336 programmable I/O pins suitable for extensive peripheral interfacing and multi‑lane I/O configurations.
- Process and Core Voltage Built on a low‑power 28 nm process with a nominal 1.1 V core (operating supply range 1.07 V–1.13 V), enabling efficient core power delivery.
- Transceivers and System Integration (Cyclone V family) Family features include integrated high‑speed transceivers and hard memory controllers for high‑bandwidth connectivity and external memory interfacing.
- Package and Mounting 672‑BGA (672‑FBGA, 27×27) surface‑mount package for compact board integration and reliable solder attach.
- Temperature and Grade Commercial grade device specified for 0 °C to 85 °C operation.
- Compliance RoHS‑compliant for environmental regulatory alignment.
Typical Applications
- Industrial Control and Automation Use the high logic density and large embedded memory for motion control, real‑time processing, and industrial protocol bridging.
- Wireless and Wireline Communications Leverage the Cyclone V family’s integrated transceivers and hard memory controllers for baseband processing, protocol offload, and packet buffering.
- Defense and Aerospace Systems Apply the device’s programmable fabric and on‑chip memory to signal processing, data aggregation, and custom I/O interfaces in commercial‑grade deployments.
Unique Advantages
- High programmable capacity: 301,000 logic elements enable complex IP integration and substantial custom logic implementation.
- Significant on‑chip memory: Approximately 14.25 Mbits of embedded RAM reduces dependence on external memory for many buffering and lookup needs.
- Broad I/O flexibility: 336 I/Os provide broad peripheral and bus interfacing options for dense board designs.
- Low‑power process foundation: 28 nm low‑power process technology and nominal 1.1 V core enable efficient power characteristics for the device family.
- Compact, production‑ready packaging: 672‑FBGA (27×27) surface‑mount package supports compact layouts and standard assembly processes.
- Regulatory alignment: RoHS compliance helps meet environmental requirements for commercial products.
Why Choose 5CGXBC9D6F27C7N?
The 5CGXBC9D6F27C7N combines substantial logic density, sizeable embedded memory, and a high I/O count in a compact 672‑BGA package, making it well suited to commercial systems that demand integration of complex logic, substantial buffering, and flexible interfacing. As a member of the Cyclone V GX family, it benefits from series features such as support for high‑speed transceivers and hard memory controllers, providing a platform capable of handling high‑bandwidth and integration‑heavy designs.
This device is targeted at designers and teams developing commercial industrial, wireless/wireline, and defense‑oriented applications who require a balance of density, on‑chip memory, and I/O scalability with RoHS compliance and standard commercial temperature ratings.
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