5CGXBC9A7U19C8N

The 5CGXBC9A7U19C8N is an Intel Cyclone V GX field-programmable gate array (FPGA) in a 484-FBGA surface-mount package. It pairs high logic capacity with abundant on-chip memory and a broad I/O complement to implement complex custom logic, protocol bridging, and signal processing functions.

Built on TSMC's 28 nm low-power process and designed with integrated transceivers and hard memory controllers (as documented for Cyclone V GX devices), this part targets applications in industrial, wireless and wireline, and military markets that require high integration and efficient on-chip resources.

Key Features

• Core and process — Based on TSMC 28 nm low-power (28LP) process with a nominal core supply in the 1.07 V to 1.13 V range.
• Logic capacity — 301,000 logic elements and 113,560 CLBs to support large, complex designs.
• Embedded memory — Approximately 14.25 Mbits of on-chip RAM (14,251,008 bits) for buffering, LUTRAM, and local storage.
• I/O and packaging — 240 general-purpose I/O pins in a 484-FBGA (484-UBGA, 19×19) surface-mount package suitable for high-density board designs.
• Commercial operating range — Rated for operation from 0 °C to 85 °C; RoHS-compliant.
• Integrated system features — Cyclone V GX family features include integrated transceivers and hard memory controllers to simplify high-bandwidth interfaces.

Typical Applications

• Wireless and wireline communications — Protocol offload, framing, and interface bridging leveraging high logic density and integrated transceivers.
• Industrial systems — Control, data aggregation, and interface consolidation where a commercial-grade FPGA meets system requirements.
• Defense and military systems — Custom signal processing and real-time logic functions that benefit from large logic arrays and embedded memory.
• High-density I/O platforms — Applications requiring many external interfaces and compact packaging, enabled by 240 I/Os in a 19×19 BGA footprint.

Unique Advantages

• High integration density: Large logic element count and substantial on-chip RAM reduce reliance on external logic and memory, simplifying BOM and board complexity.
• Flexible I/O and interface support: 240 I/Os plus Cyclone V GX family transceiver and memory controller features enable multi-protocol designs and direct external-memory interfacing.
• Low-voltage operation: Narrow core voltage range (1.07–1.13 V) aligns with modern low-power system rails.
• Compact, manufacturable package: 484-FBGA (19×19) surface-mount package provides a balance of I/O density and board-area efficiency for volume production.
• Commercial-grade compliance: Specified for 0 °C to 85 °C operation and RoHS-compliant for standard electronic product environments.

Why Choose 5CGXBC9A7U19C8N?

This Cyclone V GX FPGA delivers a combination of high logic capacity, substantial embedded memory, and a large I/O complement in a compact 484-FBGA package. Its low-voltage 28 nm implementation and Cyclone V GX family features (integrated transceivers and memory controllers) make it suitable for designs that require on-chip resources to minimize external components while maintaining interface flexibility.

Choose 5CGXBC9A7U19C8N for mid- to high-complexity designs where commercial-grade temperature operation, high logic density, and strong on-chip memory capacity provide long-term scalability and straightforward integration into standard production flows.

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