5CGXBC7D6F31C7N

The 5CGXBC7D6F31C7N is a Cyclone® V GX family FPGA offering high logic density and on-chip memory in a compact 896-BGA package. Built on 28 nm low-power process technology with a nominal 1.1 V core, this device targets cost- and bandwidth-sensitive designs in industrial, wireless/wireline and military segments.

With 149,500 logic elements, approximately 7.88 Mbits of embedded memory and integrated high-speed transceiver and hard memory controller technologies (Cyclone V family features), it provides a balanced combination of programmable logic, memory and I/O for system-level integration.

Key Features

• Logic Capacity  Approximately 149,500 logic elements to support complex programmable logic and system functions.
• On-chip Memory  Approximately 7.88 Mbits of embedded memory for buffering, packet handling, and local data storage.
• I/O Resources  480 user I/O pins to support wide peripheral and bus interfacing requirements.
• Core Technology & Voltage  Built on TSMC 28 nm low-power (28LP) process with a core voltage range of 1.07 V to 1.13 V (nominal 1.1 V).
• High-speed Interfaces (family)  Cyclone V family includes integrated transceivers and hard memory controllers; family transceiver capability includes supported rates such as 3.125 Gbps and 6.144 Gbps per the device overview.
• Package & Mounting  896-ball BGA (896‑FBGA, 31 × 31 mm) surface-mount package for dense board-level integration.
• Operating Range & Grade  Commercial grade device rated for 0 °C to 85 °C operation.
• Environmental Compliance  RoHS‑compliant construction for regulatory and assembly compatibility.

Typical Applications

• Industrial Systems  Programmable control, data aggregation and protocol bridging in factory automation and instrumentation where commercial‑grade FPGA resources are required.
• Wireless & Wireline Infrastructure  Bandwidth-oriented roles such as protocol processing, packet buffering and interface bridging leveraging on-chip memory and high-speed transceiver technologies described for the Cyclone V family.
• Embedded & Military Applications  Custom processing and protocol offload where configurable logic density and significant I/O are needed in a compact BGA footprint.

Unique Advantages

• High logic density: 149,500 logic elements enable integration of substantial control, datapath and interface logic within a single device.
• Substantial embedded memory: Approximately 7.88 Mbits of on-chip RAM reduces external memory dependency for buffering and local storage.
• Robust I/O capability: 480 I/O pins provide flexible connectivity for parallel buses, high-pin-count peripherals and multi-channel interfaces.
• Low-voltage core: 1.07–1.13 V supply range with a nominal 1.1 V core supports designs optimized for reduced power consumption on 28 nm low-power process technology.
• Compact, manufacturable package: 896-FBGA (31 × 31 mm) surface-mount package balances board density with thermal and routing considerations for mid- to high-density designs.
• Regulatory readiness: RoHS compliance simplifies assembly and regulatory acceptance for commercial products.

Why Choose 5CGXBC7D6F31C7N?

The 5CGXBC7D6F31C7N positions itself where the Cyclone V GX family’s balance of logic, memory and I/O meets cost- and bandwidth-conscious system requirements. Its combination of approximately 149,500 logic elements, ~7.88 Mbits of embedded RAM, and 480 I/Os in a 896‑BGA package makes it well suited for compact, integrative designs that demand significant programmable resources without moving to higher-cost device classes.

Engineers building commercial-grade industrial, wireless/wireline or military applications will find this device offers a practical mix of integration, power-efficient 28 nm technology and manufacturing-ready packaging to support long-term product deployment and design scalability.

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