5CGXBC7D7F27C8N

IC FPGA 336 I/O 672FBGA
Part Description

Cyclone® V GX Field Programmable Gate Array (FPGA) IC 336 7880704 149500 672-BGA

Quantity 809 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package672-FBGA (27x27)GradeCommercialOperating Temperature0°C – 85°C
Package / Case672-BGANumber of I/O336Voltage1.07 V - 1.13 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs56480Number of Logic Elements/Cells149500
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits7880704

Overview of 5CGXBC7D7F27C8N – Cyclone® V GX FPGA, 672-BGA, 149,500 logic elements

The 5CGXBC7D7F27C8N is a Cyclone® V GX Field Programmable Gate Array (FPGA) IC in a 672-ball BGA package. It provides a dense programmable fabric with 149,500 logic elements and approximately 7.88 Mbits of embedded memory, targeted at designers needing mid-range FPGA capacity with flexible I/O and memory resources.

Drawn from the Cyclone V family architecture, this device is suitable for applications across industrial, wireless and wireline, military, and automotive markets where integration, low-power operation, and I/O capability are important design drivers.

Key Features

  • Logic Capacity  149,500 logic elements for implementing complex control, signal-processing, and protocol logic.
  • Embedded Memory  Approximately 7.88 Mbits of on-chip RAM for buffering, FIFOs, and embedded storage.
  • I/O Count  336 user I/O pins to support parallel interfaces, GPIOs, and diverse board-level connectivity needs.
  • Process and Core Voltage  Built on TSMC 28-nm low-power (28LP) technology with a documented supply range of 1.07 V to 1.13 V and a 1.1 V core reference.
  • Enhanced Logic Architecture  Cyclone V family features such as an enhanced 8-input adaptive logic module (ALM) and variable-precision DSP blocks are part of the device series design.
  • Package and Mounting  672-ball FBGA (27 × 27 mm) package, surface-mountable, providing a compact footprint for high-density board layouts.
  • Operating Range and Grade  Commercial grade device with an operating temperature range of 0 °C to 85 °C.
  • Compliance  RoHS-compliant for regulatory and environmental considerations.

Typical Applications

  • High-bandwidth communications  Use the device’s large logic array and abundant I/O to implement protocol bridging, packet processing, and board-level interface control.
  • Embedded signal processing  Leverage the logic capacity and embedded memory to implement DSP pipelines, data buffering, and custom acceleration blocks.
  • Industrial control and automation  Apply the FPGA’s I/O density and on-chip RAM for motor control, sensor aggregation, and deterministic control logic.
  • Custom compute and prototyping  Ideal for FPGA-based prototyping and custom IP development where mid-range logic density and flexible I/O are required.

Unique Advantages

  • High logic density: 149,500 logic elements enable consolidation of multiple functions and reduction of system-level components.
  • Substantial on-chip memory: Approximately 7.88 Mbits of embedded RAM supports buffering and state storage without external memory in many designs.
  • Broad I/O availability: 336 I/Os simplify external device interfacing and reduce the need for additional bridge components.
  • Low-voltage core operation: Designed for 1.07–1.13 V supply operation with a 1.1 V core reference to support lower overall power consumption.
  • Compact, board-ready package: 672-FBGA (27 × 27 mm) surface-mount package is suited to dense, space-constrained PCB layouts.
  • Regulatory-friendly: RoHS compliance supports environmentally conscious product designs and supply-chain requirements.

Why Choose 5CGXBC7D7F27C8N?

The 5CGXBC7D7F27C8N delivers a balanced combination of logic capacity, embedded memory, and I/O count in a compact 672-ball FBGA package. It aligns with Cyclone V family design goals of lower power and integration, making it suitable for applications that require substantial on-chip resources without moving to higher-cost device classes.

This part is appropriate for design teams building mid-range FPGA solutions where compact packaging, meaningful on-chip RAM, and flexible I/O are required. Its commercial-grade temperature range and RoHS compliance make it straightforward to integrate into standard production environments.

If you would like pricing, availability, or a custom quote for 5CGXBC7D7F27C8N, request a quote or contact sales to submit your requirements and receive a prompt response.

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