5CGXBC9E7F35C8N

The 5CGXBC9E7F35C8N is a Cyclone® V GX FPGA in a 1152-BGA package from Intel, offered for commercial-grade applications. It provides a high-density, low-power programmable fabric with integrated high-speed features suitable for industrial, wireless/wireline, and military applications.

Built on the Cyclone V device family architecture, this device combines a large logic fabric, substantial embedded memory, extensive I/O, and package-level integration to accelerate complex system designs while addressing power and integration requirements.

Key Features

• Logic Capacity — 301,000 logic elements to implement complex digital functions and state machines.
• Embedded Memory — Approximately 13.59 Mbits of embedded memory (14,251,008 bits) for on-chip buffering, lookup tables, and data storage.
• I/O Density — 560 user I/Os for broad connectivity to peripherals, memory, and external interfaces.
• Process and Core Voltage — Built on TSMC 28-nm low-power (28LP) process technology with a 1.1 V core and supported supply range of 1.07 V to 1.13 V.
• Integrated High-Speed Resources — Cyclone V GX family enhancements include integrated transceivers and hard memory controllers to support higher bandwidth system designs.
• Package and Mounting — 1152-FBGA (35 × 35 mm) surface-mount package (1152-BGA), enabling compact board-level integration.
• Commercial Grade Operating Range — Rated for 0 °C to 85 °C operation for standard commercial environments.
• Standards and Compliance — RoHS-compliant for environmental and lead-free process compatibility.

Typical Applications

• Industrial Control — Use the device for motor control logic, deterministic I/O handling, and custom control algorithms where high logic capacity and extensive I/O are required.
• Wireless and Wireline Infrastructure — Implement protocol processing, packet buffering, and interface bridging leveraging the integrated transceivers and on-chip memory.
• Defense and Aerospace Systems — Deploy custom signal processing and interface logic in military applications that benefit from programmable hardware and substantial on-chip resources.

Unique Advantages

• High Integration Density: 301,000 logic elements and approximately 13.59 Mbits of embedded memory reduce the need for external logic and memory, simplifying board design.
• Wide I/O Capability: 560 I/Os allow flexible interfacing to a broad set of peripherals, sensors, and external subsystems without extensive glue logic.
• Low-Power Process: TSMC 28-nm low-power technology and an approximate 1.1 V core voltage help control system power consumption in cost-sensitive designs.
• System Bandwidth Enablers: Integrated transceivers and hard memory controllers on Cyclone V GX devices accelerate high-bandwidth data paths and external memory access.
• Compact Board Footprint: 1152-FBGA (35×35 mm) package provides a high-pin-count solution in a compact surface-mount form factor for space-constrained boards.
• Commercial Reliability: Specified 0 °C to 85 °C operating range and RoHS compliance for standard commercial deployments.

Why Choose 5CGXBC9E7F35C8N?

The 5CGXBC9E7F35C8N Cyclone V GX FPGA offers a balance of logic capacity, embedded memory, and I/O density in a compact 1152-BGA package, making it a practical choice for engineers building cost- and power-conscious systems that still require substantial programmable resources. Its 28-nm low-power process and supported core voltage range align with designs that prioritize lower power consumption while retaining the flexibility of FPGA-based implementation.

This device is well suited for development teams and OEMs targeting industrial automation, wireless/wireline infrastructure, and defense applications that need scalable programmable logic, on-chip memory, and integrated high-speed features to reduce external component count and accelerate time-to-deployment.

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