5CGTFD9E5F31C7N

IC FPGA 480 I/O 896FBGA
Part Description

Cyclone® V GT Field Programmable Gate Array (FPGA) IC 480 14251008 301000 896-BGA

Quantity 565 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package896-FBGA (31x31)GradeCommercialOperating Temperature0°C – 85°C
Package / Case896-BGANumber of I/O480Voltage1.07 V - 1.13 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs113560Number of Logic Elements/Cells301000
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits14251008

Overview of 5CGTFD9E5F31C7N – Cyclone® V GT FPGA, 301,000 logic elements, 896‑BGA

The 5CGTFD9E5F31C7N is an Intel Cyclone® V GT field-programmable gate array (FPGA) supplied in a 896‑BGA (31×31) surface-mount package. It delivers a high‑density programmable fabric with 301,000 logic elements, approximately 14.25 Mbits of embedded memory, and 480 I/O pins for demanding system designs.

Designed for applications that require efficient integration of digital logic, high-speed serial interfaces and memory subsystems, this Cyclone V GT device leverages the Cyclone V device family attributes—low-power 28 nm process technology and integrated transceivers and memory controllers—to address industrial, wireless/wireline and military application requirements where commercial-grade temperature and supply ranges are acceptable.

Key Features

  • Logic Capacity  301,000 logic elements (LEs) to implement complex digital functions and custom accelerators.
  • Embedded Memory  Approximately 14.25 Mbits of on-chip RAM to support buffering, lookup tables and custom memory architectures.
  • I/O Density  480 general-purpose I/O pins for broad connectivity to peripherals, sensors and external interfaces.
  • High‑Speed Interfaces  Cyclone V GT family includes integrated transceivers and hard memory controllers for high-bandwidth serial links and external memory interfacing (series-level feature).
  • Process and Power  Built on TSMC 28 nm low-power (28LP) technology; nominal core supply range specified at 1.07 V to 1.13 V for predictable power planning.
  • Commercial Temperature Grade  Specified operating temperature range of 0 °C to 85 °C for standard commercial applications.
  • Package and Mounting  896‑FBGA (31×31) supplier package, surface-mount mounting for compact board-level integration.
  • Regulatory  RoHS compliant.

Typical Applications

  • Industrial Control  Use the device for motor control, machine vision pre‑processing, or deterministic I/O aggregation where dense logic and plentiful I/O are needed.
  • Wireless and Wireline Infrastructure  Leverage integrated transceivers and memory controller support for protocol handling, framing, and high‑speed data path acceleration.
  • Defense and Aerospace (Commercial Grade)  Implement custom signal processing and interface bridging in systems that operate within commercial temperature ranges.
  • High‑Volume, Cost‑Sensitive Designs  Cyclone V family attributes—low-power process and integrated hard IP—help reduce component count and total system cost.

Unique Advantages

  • High Logic Density:  301,000 logic elements enable substantial on‑chip implementation of custom logic, state machines and accelerators without offloading to external devices.
  • Significant On‑Chip Memory:  Approximately 14.25 Mbits of embedded RAM reduces reliance on external memory for buffering and lookup functions, simplifying board design.
  • Broad I/O Count:  480 I/Os provide flexibility for interfacing with multiple peripherals, sensors and daughtercards from a single device.
  • Integrated High‑Speed IP (Family Feature):  Cyclone V GT family-level integration of transceivers and hard memory controllers supports high-bandwidth links and efficient external memory access.
  • Predictable Power Envelope:  Narrow core supply range (1.07 V–1.13 V) assists in power-supply design and system-level power optimization.
  • Compact Surface-Mount Package:  896‑BGA (31×31) package supports high pin-count integration in space-constrained boards.

Why Choose 5CGTFD9E5F31C7N?

The 5CGTFD9E5F31C7N provides a balanced combination of large programmable logic capacity, ample embedded memory and high I/O count in a compact BGA package, making it a strong option for commercial-grade systems that need on‑chip resources and flexible interfacing. Its placement in the Cyclone V GT family brings series-level benefits—low-power 28 nm technology and integrated transceiver and memory IP—that simplify system architecture and reduce component count.

This device suits engineering teams building industrial, wireless/wireline or defense-oriented systems (within commercial temperature limits) who require scalable FPGA resources, predictable power requirements and RoHS compliance for streamlined manufacturing.

Request a quote or submit an inquiry to receive pricing, availability and delivery information for 5CGTFD9E5F31C7N.

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