5CGTFD9D5F27I7N
| Part Description |
Cyclone® V GT Field Programmable Gate Array (FPGA) IC 336 14251008 301000 672-BGA |
|---|---|
| Quantity | 922 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 672-FBGA (27x27) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 672-BGA | Number of I/O | 336 | Voltage | 1.07 V - 1.13 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 113560 | Number of Logic Elements/Cells | 301000 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 14251008 |
Overview of 5CGTFD9D5F27I7N – Cyclone V GT FPGA, 301,000 logic elements, 672-BGA
The 5CGTFD9D5F27I7N is an Intel Cyclone® V GT field programmable gate array (FPGA) in a 672-BGA package designed for cost-sensitive, bandwidth-focused applications. As a member of the Cyclone V family, it leverages 28 nm low-power process technology and family-level enhancements such as integrated transceivers and hard memory controllers to address industrial, communications, and embedded signal-processing use cases.
This device provides a high-density logic fabric and substantial on-chip memory alongside a large I/O count and industrial operating range, enabling compact, integrated designs that require programmable logic, external memory interfacing, and high-speed serial connectivity.
Key Features
- High-density logic — 301,000 logic elements suitable for complex FPGA architectures and substantial custom logic implementation.
- Embedded memory — Approximately 13.59 Mbits of on-chip RAM (total RAM bits: 14,251,008) for buffering, lookup tables, and data storage close to logic.
- I/O capacity — 336 general-purpose I/Os to support broad external connectivity and parallel interfaces.
- Transceivers and memory controllers — Family-level features include integrated low-power transceivers and hard memory controller IP for high-bandwidth links and external memory interfaces.
- Power and voltage — Core supply operating range from 1.07 V to 1.13 V, aligning with Cyclone V low-voltage core operation.
- Industrial temperature range — Rated for −40 °C to 100 °C operation, suitable for industrial environments.
- Package and mounting — 672-ball BGA (672-FBGA, 27 × 27) surface-mount package for compact board-level integration.
- Regulatory — RoHS-compliant for environmental compliance in assemblies.
Typical Applications
- Industrial control and automation — Implements motor control, sensor fusion, and real-time processing functions using high logic capacity and substantial on-chip memory within industrial temperature requirements.
- Communications infrastructure — Supports wireline and wireless interface tasks where integrated transceivers and hard memory controllers enable high-throughput data paths and external memory interfacing.
- Defense and aerospace — Deploys programmable signal-processing blocks and configurable I/O for radar, SIGINT, and other mission systems that require rugged temperature performance.
- Embedded systems and prototyping — Large logic element count and rich I/O make this device suitable for system integration, SoC prototyping, and custom hardware acceleration tasks.
Unique Advantages
- Large programmable capacity: 301,000 logic elements provide headroom for complex algorithms, custom accelerators, and multi-function designs.
- Substantial on-chip RAM: Approximately 13.59 Mbits of embedded memory reduces dependence on external RAM for many buffering and state-storage needs.
- Extensive I/O and package density: 336 I/Os in a 672-FBGA (27 × 27) package allows high pin-count designs in a compact surface-mount footprint.
- Industrial-ready thermal range: −40 °C to 100 °C rating supports deployment in demanding environments without additional temperature derating.
- Family-level integration: Cyclone V devices include integrated transceivers and hard memory controllers to simplify high-speed interface and memory subsystem design.
- Compliant and manufacturable: RoHS compliance and standard BGA mounting streamline assembly and regulatory acceptance.
Why Choose 5CGTFD9D5F27I7N?
The 5CGTFD9D5F27I7N combines a high logic element count, significant on-chip memory, and extensive I/O in a compact 672-BGA package, making it a strong choice for engineers building industrial, communications, and embedded systems that require programmable flexibility and reliable operation across a wide temperature range. Its family-level features—such as integrated transceivers and hard memory controllers—help consolidate system-level functions and reduce external component count.
This device is suited to development teams and OEMs seeking scalable FPGA resources with a focus on integration, thermal robustness, and compatibility with established Cyclone V design flows and toolchains.
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