5SEE9H40I3G

IC FPGA 696 I/O 1517HBGA
Part Description

Stratix® V E Field Programmable Gate Array (FPGA) IC 696 53248000 840000 1517-BBGA, FCBGA

Quantity 1,793 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Device Package1517-HBGA (45x45)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1517-BBGA, FCBGANumber of I/O696Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs317000Number of Logic Elements/Cells840000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits53248000

Overview of 5SEE9H40I3G – Stratix® V E FPGA, 840,000 logic elements, 696 I/O, 1517-BBGA

The 5SEE9H40I3G is an Intel Stratix® V E Field Programmable Gate Array (FPGA) offered in a 1517-BBGA FCBGA package. It delivers high-density programmable logic, a large embedded memory complement, and a broad I/O count for demanding industrial applications.

Designed for system-level integration, this industrial-grade Stratix V E device targets applications that require substantial logic capacity, extensive on-chip RAM, and robust I/O connectivity while operating across a wide temperature and supply range.

Key Features

  • Logic Capacity 840,000 logic elements (cells) to implement large, complex designs and custom hardware accelerators.
  • Embedded Memory Approximately 53.25 Mbits of on-chip RAM for buffering, frame storage, and algorithm state memory.
  • I/O Density 696 I/O pins to support extensive external interfaces, parallel buses, and mixed-signal front-end connectivity.
  • Power and Core Supply Core supply range specified from 820 mV to 880 mV to match target power-rail designs and system constraints.
  • Industrial Temperature Range Rated for operation from –40 °C to 100 °C for deployment in industrial environments.
  • Package and Mounting 1517-BBGA (FCBGA) package; supplier device package listed as 1517-HBGA (45 × 45). Surface-mount mounting type for standard PCB assembly.
  • Regulatory Compliance RoHS compliant to meet common environmental and manufacturing requirements.

Typical Applications

  • High-density signal processing — Implement DSP pipelines, custom accelerators, and real-time data processing using extensive logic and embedded RAM.
  • Network and communications infrastructure — Use the large I/O complement and programmable fabric for protocol bridging, packet processing, and interface conversion.
  • Industrial control and automation — Deploy in motor control, machine vision, and industrial I/O aggregation where wide temperature range and robust packaging are required.
  • Prototyping and system integration — Integrate complex system functions into a single device to reduce board-level components and accelerate time to market.

Unique Advantages

  • Substantial logic resources: 840,000 logic elements enable consolidation of multi-function designs into a single FPGA, reducing system complexity.
  • Large on-chip memory: Approximately 53.25 Mbits of embedded RAM supports deep buffering and stateful algorithms without immediate external memory dependence.
  • High I/O count: 696 I/Os provide flexibility for interfacing with multiple peripherals, sensors, and high-pin-count mezzanine connectors.
  • Industrial robustness: Specified operation from –40 °C to 100 °C and surface-mount packaging suited for industrial environments.
  • Controlled core supply: Narrow core voltage range (820 mV–880 mV) helps designers plan predictable power delivery for high-density logic.
  • Environmentally compliant: RoHS compliance supports modern manufacturing and regulatory requirements.

Why Choose 5SEE9H40I3G?

The 5SEE9H40I3G places a high-density Stratix V E FPGA into a robust industrial-grade package, combining large logic capacity, substantial embedded memory, and extensive I/O in a surface-mount 1517-BBGA form factor. It is suited to engineers building complex, integration-focused systems that require a balance of programmability, memory, and connectivity within defined power and temperature envelopes.

This device is appropriate for teams aiming to consolidate functions, accelerate hardware offload, or prototype system-level integration while relying on Intel’s Stratix V family datasheet guidance for electrical and operating characteristics.

Request a quote or submit an inquiry to check availability and obtain pricing and lead-time information for the 5SEE9H40I3G. Our team can provide the specific ordering details and support required to move your design forward.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1968


    Headquarters: Santa Clara, California, USA


    Employees: 130,000+


    Revenue: $54.23 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018


    Featured Products
    Latest News
    keyboard_arrow_up