5SEE9H40I3G
| Part Description |
Stratix® V E Field Programmable Gate Array (FPGA) IC 696 53248000 840000 1517-BBGA, FCBGA |
|---|---|
| Quantity | 1,793 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 8 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1517-HBGA (45x45) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1517-BBGA, FCBGA | Number of I/O | 696 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 317000 | Number of Logic Elements/Cells | 840000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 53248000 |
Overview of 5SEE9H40I3G – Stratix® V E FPGA, 840,000 logic elements, 696 I/O, 1517-BBGA
The 5SEE9H40I3G is an Intel Stratix® V E Field Programmable Gate Array (FPGA) offered in a 1517-BBGA FCBGA package. It delivers high-density programmable logic, a large embedded memory complement, and a broad I/O count for demanding industrial applications.
Designed for system-level integration, this industrial-grade Stratix V E device targets applications that require substantial logic capacity, extensive on-chip RAM, and robust I/O connectivity while operating across a wide temperature and supply range.
Key Features
- Logic Capacity 840,000 logic elements (cells) to implement large, complex designs and custom hardware accelerators.
- Embedded Memory Approximately 53.25 Mbits of on-chip RAM for buffering, frame storage, and algorithm state memory.
- I/O Density 696 I/O pins to support extensive external interfaces, parallel buses, and mixed-signal front-end connectivity.
- Power and Core Supply Core supply range specified from 820 mV to 880 mV to match target power-rail designs and system constraints.
- Industrial Temperature Range Rated for operation from –40 °C to 100 °C for deployment in industrial environments.
- Package and Mounting 1517-BBGA (FCBGA) package; supplier device package listed as 1517-HBGA (45 × 45). Surface-mount mounting type for standard PCB assembly.
- Regulatory Compliance RoHS compliant to meet common environmental and manufacturing requirements.
Typical Applications
- High-density signal processing — Implement DSP pipelines, custom accelerators, and real-time data processing using extensive logic and embedded RAM.
- Network and communications infrastructure — Use the large I/O complement and programmable fabric for protocol bridging, packet processing, and interface conversion.
- Industrial control and automation — Deploy in motor control, machine vision, and industrial I/O aggregation where wide temperature range and robust packaging are required.
- Prototyping and system integration — Integrate complex system functions into a single device to reduce board-level components and accelerate time to market.
Unique Advantages
- Substantial logic resources: 840,000 logic elements enable consolidation of multi-function designs into a single FPGA, reducing system complexity.
- Large on-chip memory: Approximately 53.25 Mbits of embedded RAM supports deep buffering and stateful algorithms without immediate external memory dependence.
- High I/O count: 696 I/Os provide flexibility for interfacing with multiple peripherals, sensors, and high-pin-count mezzanine connectors.
- Industrial robustness: Specified operation from –40 °C to 100 °C and surface-mount packaging suited for industrial environments.
- Controlled core supply: Narrow core voltage range (820 mV–880 mV) helps designers plan predictable power delivery for high-density logic.
- Environmentally compliant: RoHS compliance supports modern manufacturing and regulatory requirements.
Why Choose 5SEE9H40I3G?
The 5SEE9H40I3G places a high-density Stratix V E FPGA into a robust industrial-grade package, combining large logic capacity, substantial embedded memory, and extensive I/O in a surface-mount 1517-BBGA form factor. It is suited to engineers building complex, integration-focused systems that require a balance of programmability, memory, and connectivity within defined power and temperature envelopes.
This device is appropriate for teams aiming to consolidate functions, accelerate hardware offload, or prototype system-level integration while relying on Intel’s Stratix V family datasheet guidance for electrical and operating characteristics.
Request a quote or submit an inquiry to check availability and obtain pricing and lead-time information for the 5SEE9H40I3G. Our team can provide the specific ordering details and support required to move your design forward.

Date Founded: 1968
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