5SEE9H40I2LG
| Part Description |
Stratix® V E Field Programmable Gate Array (FPGA) IC 696 53248000 840000 1517-BBGA, FCBGA |
|---|---|
| Quantity | 192 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 8 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1517-HBGA (45x45) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1517-BBGA, FCBGA | Number of I/O | 696 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 317000 | Number of Logic Elements/Cells | 840000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 53248000 |
Overview of 5SEE9H40I2LG – Stratix® V E Field Programmable Gate Array (FPGA), 696 I/O, 1517-BBGA
The 5SEE9H40I2LG is a Stratix V E family FPGA from Intel delivering high logic density, extensive embedded memory, and a large I/O complement in a 1517-BBGA FCBGA package. It targets designs that require substantial programmable logic capacity and high channel counts within an industrial temperature envelope.
Key device characteristics include 840,000 logic elements, approximately 53 Mbits of on-chip RAM, 696 user I/Os, and an industrial operating range of –40 °C to 100 °C, with a core supply range of 820 mV to 880 mV.
Key Features
- Core & Logic Capacity 840,000 logic elements providing a very large programmable fabric for complex FPGA implementations; the device also lists 317,000 logic blocks.
- Embedded Memory Approximately 53 Mbits of on-chip RAM for large buffering, table storage, or on-chip data structures.
- I/O Density 696 user I/Os to support wide parallel interfaces, high-channel-count connectivity, or dense system integration.
- Package & Mounting 1517-BBGA (FCBGA) package, supplier device package 1517-HBGA (45×45), surface-mount construction for board-level integration.
- Power and Supply Core supply range of 820 mV to 880 mV, enabling low-voltage core operation consistent with Stratix V E device requirements.
- Operating Range & Grade Industrial grade with an operating temperature range of –40 °C to 100 °C for deployments in temperature-variable environments.
- Environmental Compliance RoHS-compliant for regulatory and manufacturing alignment.
Typical Applications
- High-density programmable compute Use the device’s 840,000 logic elements and extensive embedded RAM to implement large FPGA-based accelerators or custom datapath engines.
- I/O-intensive industrial systems 696 I/Os enable dense interfacing for multi-channel acquisition, aggregation, or gate-level system control in industrial equipment.
- Thermally demanding deployments Industrial temperature rating (–40 °C to 100 °C) supports use in applications exposed to wide ambient temperature variation.
- Low-voltage core designs Core supply range of 0.82 V–0.88 V supports designs optimized for low-voltage FPGA operation.
Unique Advantages
- High integration density: Large logic and memory resources reduce the need for multi-FPGA partitioning and simplify system architecture.
- Extensive I/O capacity: 696 user I/Os enable direct interfacing to many peripherals and parallel buses without external multiplexing.
- Industrial temperature support: Rated –40 °C to 100 °C for greater deployment flexibility in harsher environments.
- Surface-mount, compact package: 1517-BBGA (45×45) packaging supports high-density PCB layouts while maintaining robust connectivity.
- Regulatory alignment: RoHS compliance simplifies environmental and manufacturing requirements.
Why Choose 5SEE9H40I2LG?
The 5SEE9H40I2LG combines very large programmable logic capacity, substantial on-chip RAM, and one of the highest I/O counts available in its package size, making it well suited for designs that require dense integration of logic, memory, and interfaces. Its industrial temperature rating and defined core supply range make it appropriate for temperature-variable and low-voltage FPGA applications.
This device is positioned for engineering teams needing scalable, high-capacity FPGA resources in a compact FCBGA package while maintaining compliance with environmental regulations.
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