5SEE9H40C4N

IC FPGA 696 I/O 1517HBGA
Part Description

Stratix® V E Field Programmable Gate Array (FPGA) IC 696 53248000 840000 1517-BBGA, FCBGA

Quantity 595 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1517-HBGA (45x45)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1517-BBGA, FCBGANumber of I/O696Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs317000Number of Logic Elements/Cells840000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits53248000

Overview of 5SEE9H40C4N – Stratix® V E FPGA, 840,000 logic elements, 1517-BBGA (FCBGA)

The 5SEE9H40C4N is an Intel Stratix V E field-programmable gate array (FPGA) offered in a 1517-BBGA FCBGA package. Built on the Stratix V family architecture, this device targets designs that require very high logic density and extensive on-chip resources.

With 840,000 logic elements and approximately 53.25 Mbits of embedded memory, the device is suited for ASIC and system emulation, diagnostic imaging, and instrumentation applications where integration and scalability matter.

Key Features

  • Core and Architecture  Enhanced Stratix V core architecture with family-level building blocks such as adaptive logic modules (ALMs), variable-precision DSP blocks, M20K embedded memory blocks, and fractional PLLs.
  • High Logic Density  840,000 logic elements provide the capacity for large, complex designs and advanced emulation workloads.
  • Embedded Memory  Approximately 53.25 Mbits of on-chip RAM delivered via M20K memory blocks for buffering, lookup tables, and data-path storage.
  • I/O Capacity  696 general-purpose I/O pins to support wide bus interfaces and dense peripheral connectivity.
  • Power  Core supply range from 820 mV to 880 mV for the device core voltage domain.
  • Package and Mounting  1517-BBGA (FCBGA) package, supplier package listed as 1517-HBGA (45×45), designed for surface-mount assembly.
  • Operating Range and Grade  Commercial grade device with an operating temperature range of 0 °C to 85 °C.
  • Environmental Compliance  RoHS-compliant manufacturing.
  • Production Path  Stratix V family devices support a low-risk migration path to HardCopy V ASICs for higher-volume production.

Typical Applications

  • ASIC and System Emulation  Large logic capacity and on-chip memory enable hardware emulation and pre-silicon validation for complex SoC and ASIC designs.
  • Diagnostic Imaging  High logic density and block RAM provide the resources required for image processing pipelines and real-time analysis.
  • Instrumentation  Robust I/O count and flexible core resources support data acquisition, processing, and control in test and measurement systems.

Unique Advantages

  • High Integration Density: 840,000 logic elements reduce external logic and simplify system partitioning for complex designs.
  • Substantial On-Chip Memory: Approximately 53.25 Mbits of embedded RAM minimizes external memory dependency and accelerates data-path performance.
  • Generous I/O Resources: 696 I/O pins support broad interfacing options and parallel data streams.
  • Surface-Mount FCBGA Package: 1517-BBGA package provides a compact assembly option for board-level integration.
  • Commercial Temperature Range: Rated 0 °C to 85 °C for standard commercial applications.
  • Manufacturing and Compliance: RoHS-compliant device from Intel, with a defined production upgrade path to HardCopy V ASICs for volume migration.

Why Choose 5SEE9H40C4N?

The 5SEE9H40C4N combines very high logic capacity, substantial embedded memory, and a large I/O count in a compact FCBGA package, making it suitable for complex emulation, imaging, and instrumentation systems. Its Stratix V family architecture provides the configurable building blocks engineers need to implement dense, performance-oriented designs.

Designed for teams that plan for prototyping through volume production, the device supports a migration path to HardCopy V ASICs, offering a clear route to cost and performance optimization as projects scale.

Request a quote or submit an inquiry for 5SEE9H40C4N to receive pricing and availability information.

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