5SEE9H40C3G

IC FPGA 696 I/O 1517HBGA
Part Description

Stratix® V E Field Programmable Gate Array (FPGA) IC 696 53248000 840000 1517-BBGA, FCBGA

Quantity 1,111 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Device Package1517-HBGA (45x45)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1517-BBGA, FCBGANumber of I/O696Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs317000Number of Logic Elements/Cells840000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits53248000

Overview of 5SEE9H40C3G – Stratix® V E FPGA, 840,000 logic elements, ~53.25 Mbits RAM, 696 I/Os

The 5SEE9H40C3G is a Stratix® V E field-programmable gate array (FPGA) offered in a commercial temperature grade. It delivers a high logic capacity and substantial on-chip memory in a 1517-BBGA (FCBGA) package for dense, I/O-rich system designs. With a broad I/O complement and low-voltage core operation, the device targets applications that require significant programmable logic and embedded memory within a compact surface-mount package.

Key Features

  • Core capacity — 840,000 logic elements to support complex digital logic implementations.
  • Embedded memory — Approximately 53.25 Mbits of on-chip RAM (53,248,000 bits) for local data buffering and state storage.
  • High I/O count — 696 user I/Os for dense system interfacing and multi-channel connectivity.
  • Power domain — Core supply range 820 mV to 880 mV, enabling low-voltage core operation.
  • Package & mounting — 1517-BBGA (FCBGA) package; supplier device package listed as 1517-HBGA (45×45); surface-mount mounting type.
  • Temperature & grade — Commercial grade with an operating temperature range of 0 °C to 85 °C.
  • Standards compliance — RoHS compliant.

Typical Applications

  • High-density digital logic — Implement complex state machines, custom datapaths, and large-scale programmable logic using 840,000 logic elements.
  • Memory-intensive processing — Use the approximately 53.25 Mbits of embedded memory for buffering, frame storage, or algorithmic data sets that benefit from on-chip RAM.
  • I/O-heavy system interfaces — Leverage up to 696 I/Os to connect multiple parallel interfaces, sensors, or peripherals without extensive external glue logic.

Unique Advantages

  • Massive programmable logic capacity: 840,000 logic elements provide headroom for large, integrated FPGA designs.
  • Substantial on-chip memory: Approximately 53.25 Mbits of embedded RAM reduces dependence on external memory components.
  • Extensive I/O integration: 696 I/Os simplify board-level integration for multi-channel and mixed-signal systems.
  • Compact BGA footprint: 1517-BBGA (45×45 supplier package) surface-mount package enables dense PCB layouts and minimizes board area.
  • Low-voltage core operation: 820–880 mV core supply range supports low-voltage design domains where applicable.
  • Commercial-grade and RoHS compliant: Rated for 0 °C to 85 °C operation and compliant with RoHS requirements.

Why Choose 5SEE9H40C3G?

The 5SEE9H40C3G combines a high logic element count, large embedded memory, and a very high I/O density in a single commercial-grade Stratix V E FPGA package. This combination makes it well suited for designs that require significant on-chip resources and dense interfacing while maintaining a compact board footprint.

Designed for teams and applications that need scalable programmable logic capacity with substantial on-chip RAM, the 5SEE9H40C3G offers a balanced platform for integrating complex logic, data buffering, and rich I/O in commercial-temperature deployments. Its RoHS compliance and surface-mount BGA packaging support modern production and assembly workflows.

Request a quote or submit a product inquiry for pricing, availability, and lead-time details for the 5SEE9H40C3G.

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