5SEEBF45C2G

IC FPGA 840 I/O 1932FBGA
Part Description

Stratix® V E Field Programmable Gate Array (FPGA) IC 840 53248000 952000 1932-BBGA, FCBGA

Quantity 151 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package1932-FBGA, FC (45x45)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1932-BBGA, FCBGANumber of I/O840Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs359250Number of Logic Elements/Cells952000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits53248000

Overview of 5SEEBF45C2G – Stratix® V E Field Programmable Gate Array (FPGA) IC, 952,000 logic elements, ~53.25 Mbits RAM, 840 I/O

The 5SEEBF45C2G is a Stratix® V E family FPGA device in a 1932-BBGA (FCBGA) package designed for high-density, configurable logic integration. This commercial-grade device provides a large programmable fabric with 952,000 logic elements and approximately 53.25 Mbits of embedded memory, combined with 840 general-purpose I/O pins.

Designed for surface-mount assembly, the device operates from a core supply range of 870 mV to 930 mV and is specified for a commercial operating temperature range of 0 °C to 85 °C. Documentation and electrical characteristic guidance are provided as part of the Stratix V device datasheet.

Key Features

  • Logic Capacity — 952,000 logic elements provide a large programmable fabric for complex implementations and high integration.
  • Embedded Memory — Approximately 53.25 Mbits of on-chip RAM to support large buffers, FIFOs, and distributed storage.
  • High I/O Count — 840 I/O pins for extensive external connectivity and complex system interfacing.
  • Power Supply — Core voltage supply specified between 870 mV and 930 mV to match targeted power architectures.
  • Package & Mounting — 1932-BBGA (FCBGA) supplier package (1932-FBGA, FC 45×45) in a surface-mount form factor for compact board integration.
  • Operating Grade & Temperature — Commercial-grade device rated for 0 °C to 85 °C operation.
  • Standards Compliance — RoHS-compliant construction.

Unique Advantages

  • High integration density: 952,000 logic elements enable consolidation of complex functions into a single FPGA, reducing external components and board area.
  • Significant on-chip memory: Approximately 53.25 Mbits of embedded RAM supports large buffering and local data storage without external memory.
  • Extensive I/O capability: 840 I/O pins accommodate broad interfacing needs for peripherals, high-speed links, and multi-channel systems.
  • Compact FCBGA packaging: 1932-BBGA (45×45) package provides a high pin-count solution in a compact footprint for dense board designs.
  • Commercial temperature rating: Specified 0 °C to 85 °C operation suits a wide range of commercial and industrial-adjacent applications requiring standard thermal performance.
  • Regulatory friendliness: RoHS compliance simplifies environmental and materials planning for production.

Why Choose 5SEEBF45C2G?

The 5SEEBF45C2G offers a combination of very high logic density, substantial embedded memory, and a large I/O complement in a surface-mount FCBGA package—making it suitable for designs that require consolidation of complex digital systems into a single programmable device. Its commercial-grade specification and targeted core voltage range allow integration into designs with defined thermal and power envelopes.

Engineers can rely on the Stratix V device documentation for electrical and switching characteristics as they plan power delivery, timing, and I/O integration. The 5SEEBF45C2G is positioned for projects that demand a high-capacity FPGA fabric with ample on-chip RAM and extensive connectivity in a compact form factor.

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