5SEEBF45C2G
| Part Description |
Stratix® V E Field Programmable Gate Array (FPGA) IC 840 53248000 952000 1932-BBGA, FCBGA |
|---|---|
| Quantity | 151 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1932-FBGA, FC (45x45) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1932-BBGA, FCBGA | Number of I/O | 840 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 359250 | Number of Logic Elements/Cells | 952000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 53248000 |
Overview of 5SEEBF45C2G – Stratix® V E Field Programmable Gate Array (FPGA) IC, 952,000 logic elements, ~53.25 Mbits RAM, 840 I/O
The 5SEEBF45C2G is a Stratix® V E family FPGA device in a 1932-BBGA (FCBGA) package designed for high-density, configurable logic integration. This commercial-grade device provides a large programmable fabric with 952,000 logic elements and approximately 53.25 Mbits of embedded memory, combined with 840 general-purpose I/O pins.
Designed for surface-mount assembly, the device operates from a core supply range of 870 mV to 930 mV and is specified for a commercial operating temperature range of 0 °C to 85 °C. Documentation and electrical characteristic guidance are provided as part of the Stratix V device datasheet.
Key Features
- Logic Capacity — 952,000 logic elements provide a large programmable fabric for complex implementations and high integration.
- Embedded Memory — Approximately 53.25 Mbits of on-chip RAM to support large buffers, FIFOs, and distributed storage.
- High I/O Count — 840 I/O pins for extensive external connectivity and complex system interfacing.
- Power Supply — Core voltage supply specified between 870 mV and 930 mV to match targeted power architectures.
- Package & Mounting — 1932-BBGA (FCBGA) supplier package (1932-FBGA, FC 45×45) in a surface-mount form factor for compact board integration.
- Operating Grade & Temperature — Commercial-grade device rated for 0 °C to 85 °C operation.
- Standards Compliance — RoHS-compliant construction.
Unique Advantages
- High integration density: 952,000 logic elements enable consolidation of complex functions into a single FPGA, reducing external components and board area.
- Significant on-chip memory: Approximately 53.25 Mbits of embedded RAM supports large buffering and local data storage without external memory.
- Extensive I/O capability: 840 I/O pins accommodate broad interfacing needs for peripherals, high-speed links, and multi-channel systems.
- Compact FCBGA packaging: 1932-BBGA (45×45) package provides a high pin-count solution in a compact footprint for dense board designs.
- Commercial temperature rating: Specified 0 °C to 85 °C operation suits a wide range of commercial and industrial-adjacent applications requiring standard thermal performance.
- Regulatory friendliness: RoHS compliance simplifies environmental and materials planning for production.
Why Choose 5SEEBF45C2G?
The 5SEEBF45C2G offers a combination of very high logic density, substantial embedded memory, and a large I/O complement in a surface-mount FCBGA package—making it suitable for designs that require consolidation of complex digital systems into a single programmable device. Its commercial-grade specification and targeted core voltage range allow integration into designs with defined thermal and power envelopes.
Engineers can rely on the Stratix V device documentation for electrical and switching characteristics as they plan power delivery, timing, and I/O integration. The 5SEEBF45C2G is positioned for projects that demand a high-capacity FPGA fabric with ample on-chip RAM and extensive connectivity in a compact form factor.
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