5SEEBH40I2LN

IC FPGA 696 I/O 1517HBGA
Part Description

Stratix® V E Field Programmable Gate Array (FPGA) IC 696 53248000 952000 1517-BBGA, FCBGA

Quantity 1,194 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1517-HBGA (45x45)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1517-BBGA, FCBGANumber of I/O696Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs359250Number of Logic Elements/Cells952000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits53248000

Overview of 5SEEBH40I2LN – Stratix® V E Field Programmable Gate Array (FPGA) IC, 952,000 logic elements

The 5SEEBH40I2LN is a Stratix V E-series FPGA built on a 28‑nm process with an enhanced core architecture and a rich set of integrated hard IP blocks. With 952,000 logic elements, approximately 53 Mbits of embedded memory, and up to 696 I/Os, this device targets high-density designs that demand large logic capacity, extensive I/O, and advanced on‑chip building blocks.

Designed for industrial-grade operation (–40 °C to 100 °C) and surface-mount deployment in a 1517‑BBGA (FCBGA) package, the device supports a low-voltage core supply and includes features that support bandwidth‑centric, data‑intensive, and high‑precision DSP applications.

Key Features

  • 28‑nm Core Architecture  Stratix V family 28‑nm process and enhanced core architecture provide the platform foundation for high logic density and integration.
  • High Logic Density  952,000 logic elements suitable for large-scale FPGA implementations including ASIC prototyping and system emulation.
  • Embedded Memory  Approximately 53 Mbits of on‑chip RAM, implemented using M20K memory blocks for mid- to large-scale buffering and data storage.
  • I/O and Transceivers  Up to 696 I/Os and integrated high-speed serial transceivers (family supports transceivers up to 28.05 Gbps) for demanding interface and bandwidth requirements.
  • DSP and Timing Resources  Variable-precision DSP blocks and fractional PLLs provide on‑chip signal processing and flexible clocking for high‑performance DSP workloads.
  • Hard IP and ASIC Path  Embedded HardCopy Block capability and hard IP support (including PCIe Gen3/Gen2/Gen1 instantiation in the family) enable low‑risk migration to HardCopy V ASICs for higher volume production.
  • Power and Supply  Core voltage range of 820 mV to 880 mV for optimized core power delivery and performance scaling.
  • Package and Mounting  1517‑BBGA (FCBGA) package, supplier device package 1517‑HBGA (45×45), surface-mount mounting type for compact system integration.
  • Industrial Temperature Rating  Rated for operation from –40 °C to 100 °C and RoHS compliant for industrial applications.

Typical Applications

  • ASIC Prototyping and System Emulation  High logic density and extensive I/O make this device suitable for prototyping ASICs and performing system emulation tasks.
  • High‑Performance DSP and Imaging  Variable‑precision DSP blocks and significant embedded memory capacity support compute‑intensive signal processing and diagnostic imaging systems.
  • Bandwidth‑Centric Networking  Integrated high‑speed transceivers and large I/O counts enable use in 40G/100G networking, packet processing, and optical communications equipment.
  • Instrumentation and Test Equipment  The combination of logic density, precision DSP, and flexible clocking is well suited for complex measurement and test applications.

Unique Advantages

  • Very high logic capacity: 952,000 logic elements allow implementation of large, complex designs without immediate partitioning across multiple devices.
  • Integrated high‑speed I/O: Up to 696 I/Os combined with family transceivers up to 28.05 Gbps reduce external PHY and interface packaging complexity.
  • On‑chip memory for buffering: Approximately 53 Mbits of embedded RAM delivered via M20K blocks supports large data sets and streaming workloads on‑chip.
  • DSP and clocking resources: Variable‑precision DSP blocks and fractional PLLs enable high‑precision signal processing and flexible timing architectures.
  • Production scalability: Family support for Embedded HardCopy Blocks and a documented path to HardCopy V ASICs facilitate lower‑risk transitions to high‑volume production.
  • Industrial‑grade operation: –40 °C to 100 °C operating range and RoHS compliance support deployment in demanding environments.

Why Choose 5SEEBH40I2LN?

The 5SEEBH40I2LN delivers a combination of very high logic density, substantial embedded memory, and extensive I/O in a single Stratix V E‑series FPGA package, making it suitable for designs that require large, integrated programmable logic and high bandwidth. Its 28‑nm architecture, DSP resources, and hard IP support provide the building blocks needed for complex DSP, emulation, and bandwidth‑intensive systems.

For teams planning prototypes that may move to higher volume ASICs, this device offers a direct, documented migration path to HardCopy V ASIC implementations while maintaining industrial temperature capability and RoHS compliance for production deployment.

Request a quote or submit an RFQ to receive pricing, availability, and lead‑time information for the 5SEEBH40I2LN.

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