5SEEBH40I3G
| Part Description |
Stratix® V E Field Programmable Gate Array (FPGA) IC 696 53248000 952000 1517-BBGA, FCBGA |
|---|---|
| Quantity | 74 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 8 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1517-HBGA (45x45) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1517-BBGA, FCBGA | Number of I/O | 696 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 359250 | Number of Logic Elements/Cells | 952000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 53248000 |
Overview of 5SEEBH40I3G – Stratix V E FPGA, 952,000 logic elements, 1517-BBGA
The 5SEEBH40I3G is a Stratix® V E Field Programmable Gate Array (FPGA) IC from Intel, offered in an industrial temperature grade. It provides a high-density programmable fabric with 952,000 logic elements and approximately 53.25 Mbits of embedded memory, suited for designs that require large on-chip logic and memory capacity.
This device is supplied in a high-pin-count BGA package and supports a wide operating temperature range and low core-voltage operation, enabling integration into industrial systems where thermal range and power domain considerations are important.
Key Features
- Core capacity — 952,000 logic elements to support large-scale programmable logic implementations.
- Embedded memory — approximately 53.25 Mbits of on-chip RAM for data buffering, state storage, and memory-intensive functions.
- I/O resources — Up to 696 general-purpose I/O pins to interface with high-pin-count systems and multiple peripheral domains.
- Package options — 1517-BBGA, FCBGA package; supplier device package listed as 1517-HBGA (45×45), surface-mount mounting type for compact board integration.
- Power — Core voltage supply range of 820 mV to 880 mV for low-voltage core operation.
- Industrial temperature grade — Rated for operation from −40 °C to 100 °C to meet industrial environment requirements.
- Compliance — RoHS compliant.
Typical Applications
- High-density FPGA designs — Use where a large number of logic elements and substantial embedded memory are required for complex programmable logic implementations.
- Industrial systems — Industrial temperature grade and wide operating temperature range support deployment in harsh or temperature-variable environments.
- High I/O-count interfaces — Up to 696 I/Os enable integration with multi-channel data paths, large sensor arrays, or dense peripheral connectivity.
Unique Advantages
- Significant logic and memory integration — 952,000 logic elements combined with ~53.25 Mbits of RAM reduce external component count and simplify system-level architecture.
- High I/O density — 696 available I/Os allow flexible partitioning of interfaces and support for complex I/O requirements without external expanders.
- Industrial temperature range — −40 °C to 100 °C rating enables deployment in demanding operational environments.
- Low-voltage core operation — 820 mV–880 mV core supply supports modern power-optimized system designs.
- Package choices for dense layouts — 1517-BBGA/FCBGA packaging and 1517-HBGA (45×45) supplier package facilitate compact board-level integration.
- RoHS compliance — Meets environmental compliance expectations for manufacturing and distribution.
Why Choose 5SEEBH40I3G?
The 5SEEBH40I3G delivers high logic density, substantial on-chip memory, and a large I/O complement in an industrial-grade Stratix V E FPGA package. Its combination of capacity, low-voltage core operation, and broad operating temperature range makes it suitable for complex, high-density designs that require robust environmental performance.
Designed for engineers and procurement teams seeking a high-capacity FPGA with clear package and electrical parameters, this device provides a scalable building block for systems that demand on-chip resources and high I/O counts while meeting RoHS requirements.
Request a quote or submit a product inquiry to get pricing, availability, and support information for the 5SEEBH40I3G.

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