5SGSMD4K2F40C3G

The 5SGSMD4K2F40C3G is a Stratix® V GS Field Programmable Gate Array (FPGA) manufactured by Intel. It delivers a high-density programmable fabric with 360,000 logic elements and approximately 19.456 Mbits of embedded memory, targeted at designs that require substantial on-chip logic and memory resources.

Packaged in a 1517-BBGA (1517-FBGA, 40×40) surface-mount package and rated for commercial temperature operation (0 °C to 85 °C), this device is suited for systems that demand large I/O counts and dense integration while operating at a low core supply voltage range of 820 mV to 880 mV.

Key Features

• Core Logic  360,000 logic elements (logic cells) to implement complex digital functions and large-scale programmable logic designs.
• Embedded Memory  Approximately 19.456 Mbits of on-chip RAM to support buffering, lookup tables, and embedded data storage.
• I/O Capacity  696 user I/O pins to accommodate high-channel-count interfaces and multi‑lane connectivity requirements.
• Power and Voltage  Core voltage supply specified from 820 mV to 880 mV for low-voltage FPGA core operation.
• Package and Mounting  1517-BBGA (supplier package: 1517-FBGA, 40×40), surface-mount FCBGA package for compact, high-density board layouts.
• Operating Grade  Commercial temperature grade with specified operating range of 0 °C to 85 °C.
• Standards Compliance  RoHS compliant.

Typical Applications

• High-density digital systems  Use the large logic element count for complex protocol implementations, custom datapaths, and control logic consolidation.
• Signal processing and buffering  Leverage approximately 19.456 Mbits of embedded RAM for real-time buffering, FIFOs, and temporary storage in streaming applications.
• Multi‑I/O interface hubs  High I/O count supports designs requiring many parallel interfaces, board-level bridging, or aggregating multiple device lanes.

Unique Advantages

• High integration density: 360,000 logic elements reduce external logic requirements and simplify board-level system architecture.
• Substantial on-chip memory: Approximately 19.456 Mbits of embedded RAM enables larger in‑fabric storage and reduced external memory dependence.
• Extensive I/O resources: 696 I/Os accommodate high channel counts and complex interconnect requirements without extensive multiplexing.
• Compact FCBGA package: 1517-BBGA (1517-FBGA, 40×40) surface-mount package supports dense PCB designs and high pin-count routing.
• Commercial temperature rating: Rated 0 °C to 85 °C for applications within commercial environmental conditions.
• Regulatory alignment: RoHS compliant for modern electronics manufacturing requirements.

Why Choose 5SGSMD4K2F40C3G?

This Stratix V GS FPGA balances very high logic capacity, significant embedded memory, and a large I/O complement in a single surface-mount FCBGA package. It is positioned for engineers and teams implementing complex digital systems that need to consolidate functionality, reduce external components, and support many interfaces on a single device.

With Intel as the manufacturer and device-level documentation covering electrical and switching characteristics for the Stratix V family, the 5SGSMD4K2F40C3G offers a scalable platform for designs that require dense programmable logic, substantial on-chip RAM, and broad I/O — all within a defined commercial temperature envelope.

Request a quote or submit an inquiry for 5SGSMD4K2F40C3G to check availability and pricing for your next high-density FPGA design.