5SGSMD4K2F40I2G

The 5SGSMD4K2F40I2G is a Stratix® V GS FPGA offered in a 1517-BBGA FCBGA package for surface-mount assembly. It delivers very large logic capacity, substantial embedded RAM, and extensive I/O, making it well suited to designs that require high integration density and broad I/O connectivity.

Specified for industrial operation, this device provides defined core supply requirements and a wide operating temperature range, enabling deployment in temperature-sensitive and rugged embedded systems.

Key Features

• Logic Capacity  Approximately 360,000 logic elements to implement complex custom logic, DSP pipelines, and wide datapaths.
• Embedded Memory  Approximately 19.46 Mbits of on-chip RAM to support buffering, state storage, and large lookup tables without external memory.
• I/O Count  696 user I/O pins to support high channel counts, parallel interfaces, and extensive peripheral connections.
• Power / Core Supply  Core supply specification of 870 mV to 930 mV for predictable power integration and regulator selection.
• Package & Mounting  1517-BBGA (FCBGA) / supplier package 1517-FBGA (40×40) in a surface-mount form factor for compact board-level integration.
• Temperature & Grade  Industrial grade with an operating temperature range of −40 °C to 100 °C for deployment in demanding environments.
• Environmental Compliance  RoHS compliant to meet common environmental and manufacturability requirements.

Typical Applications

• High-density system integration  Use where large programmable logic capacity and many I/Os are required to consolidate multiple functions into a single FPGA.
• On-chip buffering and state management  Leverage the device’s approximately 19.46 Mbits of embedded RAM for data buffering, FIFOs, and large LUT-based implementations.
• Industrial and embedded systems  Industrial-grade temperature rating supports designs intended for wide-temperature deployments and ruggedized equipment.
• Boards requiring high I/O counts  The 696 I/Os enable connection to many peripherals, sensors, or parallel interfaces without external I/O expanders.

Unique Advantages

• Large logic fabric: Approximately 360,000 logic elements let you implement complex, consolidated FPGA-based systems and reduce external component count.
• Significant on-chip memory: Nearly 19.46 Mbits of embedded RAM reduces dependence on external memory for buffering and state retention.
• Extensive I/O availability: 696 I/Os provide flexibility for diverse interfaces and high channel density on a single device.
• Industrial temperature support: Rated from −40 °C to 100 °C for reliable performance in temperature-challenging deployments.
• Compact surface-mount package: 1517-BBGA (FCBGA) 40×40 package supports dense PCB layouts while maintaining a high pin count.
• Regulated core supply: Clear core voltage window (870 mV–930 mV) simplifies power-supply design and thermal planning.

Why Choose 5SGSMD4K2F40I2G?

The 5SGSMD4K2F40I2G combines a very large programmable logic fabric, substantial on-chip RAM, and a high I/O count in a compact FCBGA package, positioned for industrial-grade embedded and system-level designs that require integration and predictable electrical/thermal parameters. Its defined core supply range and wide operating temperature help streamline power and thermal design while supporting deployment in harsher environments.

This device is appropriate for engineers and system designers looking to consolidate multiple functions into a single FPGA, reduce board-level component count, and leverage on-chip resources for buffering and logic-heavy tasks.

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