5SGSMD5K2F40C3W

The 5SGSMD5K2F40C3W is an Intel Stratix® V GS FPGA in a 1517-BBGA (FCBGA) surface-mount package. It provides high logic capacity and substantial on-chip memory for complex programmable logic implementations within commercial-temperature designs.

Key device metrics include 457,000 logic elements (cells), approximately 39.94 Mbits of embedded RAM, and 696 I/O pins. The device operates with a core supply range of 820 mV to 880 mV and is specified for 0 °C to 85 °C operation. The part is RoHS compliant.

Key Features

• Core Logic  457,000 logic elements (cells) for large-scale programmable logic implementations.
• Embedded Memory  Approximately 39.94 Mbits of on-chip RAM to support data buffering and state storage without immediate external memory dependence.
• I/O Density  696 I/O pins to enable dense system interfacing and multi-channel connectivity.
• Package and Mounting  1517-BBGA (FCBGA) package; supplier device package 1517-FBGA (40×40); surface-mount mounting type suitable for compact PCB designs.
• Power Supply  Core voltage supply specified from 820 mV to 880 mV for predictable power-domain design.
• Temperature and Grade  Commercial grade device with an operating temperature range of 0 °C to 85 °C.
• Regulatory  RoHS compliant.

Unique Advantages

• High logic capacity: 457,000 logic elements enable complex finite-state machines, large combinational logic blocks, and extensive custom datapaths on a single device.
• Substantial on-chip memory: Approximately 39.94 Mbits of embedded RAM reduces dependency on external memory for many buffering and storage needs.
• Extensive I/O count: 696 I/O pins allow for multi-channel interfacing and integration of numerous peripherals and high-density board-level routing.
• Compact BGA package: The 1517-BBGA (1517-FBGA 40×40) footprint provides a high pin-count solution in a surface-mount form factor suitable for space-constrained PCBs.
• Defined commercial operating range: Rated for 0 °C to 85 °C to match commercial-environment applications and system qualification needs.
• Predictable core power domain: Narrow core voltage window (820–880 mV) supports consistent power planning and thermal design.

Why Choose 5SGSMD5K2F40C3W?

The 5SGSMD5K2F40C3W is positioned for designs that require high logic density, large embedded memory, and a high count of I/O in a compact surface-mount BGA package. Its specification set—457,000 logic elements, approximately 39.94 Mbits of RAM, and 696 I/Os—makes it suitable for complex programmable-logic implementations within commercial-temperature systems.

As part of the Stratix V GS family, this device offers documented electrical and switching characteristics and is complemented by Intel's device documentation. The combination of integration, on-chip memory, and package density provides a scalable platform for advanced FPGA-based designs.

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