5SGSMD5K3F40C3G
| Part Description |
Stratix® V GS Field Programmable Gate Array (FPGA) IC 696 39936000 457000 1517-BBGA, FCBGA |
|---|---|
| Quantity | 528 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1517-FBGA (40x40) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1517-BBGA, FCBGA | Number of I/O | 696 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 172600 | Number of Logic Elements/Cells | 457000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 39936000 |
Overview of 5SGSMD5K3F40C3G – Stratix® V GS FPGA, 457,000 logic elements, 696 I/Os
The 5SGSMD5K3F40C3G is a Stratix® V GS family field programmable gate array (FPGA) in a 1517-ball FCBGA package. It combines high logic capacity and substantial on‑chip memory with a large I/O count to support complex, high‑density programmable designs.
Designed for commercial‑grade applications, this surface‑mount device delivers approximately 39.9 Mbits of embedded memory and 457,000 logic elements, making it suitable for advanced data processing, custom acceleration, and dense integration use cases where logic density and I/O connectivity are required.
Key Features
- Core Logic 457,000 logic elements provide substantial programmable resources for large designs and complex algorithm implementation.
- Embedded Memory Approximately 39.9 Mbits of on‑chip RAM to support buffering, lookup tables, and state storage without relying exclusively on external memory.
- I/O Capacity & Timing 696 user I/Os enable broad system connectivity; the device family documentation includes detailed I/O timing, programmable I/O delay, and output buffer delay characteristics.
- Package & Mounting 1517‑ball FCBGA (1517‑FBGA, 40×40) package in a surface‑mount form factor for compact board integration and high pin density.
- Power Supply Core voltage range specified at 820 mV to 880 mV to guide system power design and supply selection.
- Operating Grade & Temperature Commercial grade device with an operating temperature range of 0 °C to 85 °C for standard commercial applications.
- Standards Compliance RoHS compliant for environmental regulatory alignment in manufacturing and supply chains.
Typical Applications
- High‑density compute and acceleration Implement custom processing engines and hardware accelerators that require large logic arrays and on‑chip memory.
- Packet processing and network functions Use abundant I/Os and programmable timing to implement complex packet handling, protocol engines, and interface bridging.
- System prototyping and integration Integrate platform functions, glue logic, and custom peripherals in a single programmable device to reduce board complexity.
Unique Advantages
- High logic density: 457,000 logic elements enable consolidation of large designs into a single FPGA, reducing interconnect complexity.
- Significant on‑chip RAM: Approximately 39.9 Mbits of embedded memory supports buffering and stateful algorithms without immediate external memory requirements.
- Extensive I/O count: 696 I/Os allow connection to numerous peripherals, PHYs, and crossbar interfaces for versatile system designs.
- Compact FCBGA package: The 1517‑ball FCBGA (40×40) balances high pin count with a compact footprint for space‑conscious board layouts.
- Commercial readiness: Rated for 0 °C to 85 °C operation and RoHS compliant to meet mainstream production and regulatory needs.
- Defined core supply window: Core voltage specification (820 mV–880 mV) supports predictable power delivery and thermal planning.
Why Choose 5SGSMD5K3F40C3G?
This Stratix V GS FPGA part offers a balance of high logic capacity, substantial embedded memory, and a large I/O complement in a compact FCBGA package, suitable for commercial applications that require dense programmable logic and versatile interfacing. Its documented electrical and I/O characteristics help engineering teams plan power, timing, and board integration with confidence.
Choose this device when you need a single‑chip programmable solution to consolidate functions, accelerate custom processing, or prototype complex systems while maintaining clear specification guidance for power and operating conditions.
Request a quote or submit an inquiry to obtain pricing, availability, and ordering information for 5SGSMD5K3F40C3G.

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