5SGSMD5K3F40C3WN

IC FPGA 696 I/O 1517FBGA
Part Description

Stratix® V GS Field Programmable Gate Array (FPGA) IC 696 39936000 457000 1517-BBGA, FCBGA

Quantity 367 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1517-FBGA (40x40)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1517-BBGA, FCBGANumber of I/O696Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs172600Number of Logic Elements/Cells457000
Number of GatesN/AECCNOBSOLETEHTS CodeN/A
QualificationN/ATotal RAM Bits39936000

Overview of 5SGSMD5K3F40C3WN – Stratix® V GS Field Programmable Gate Array (FPGA) IC

The 5SGSMD5K3F40C3WN is a Stratix V GS family FPGA from Intel, delivered in a 1517-BBGA FCBGA surface-mount package. It provides high logic and memory capacity with extensive I/O, suitable for complex, programmable digital designs that require substantial on-chip resources.

Designed and specified for commercial operation, this device targets applications that need large embedded memory, high I/O counts, and densely packed logic in a single FPGA package.

Key Features

  • Logic Capacity — Approximately 457,000 logic elements and 172,600 LABs, enabling complex programmable logic implementations.
  • Embedded Memory — Approximately 39.9 Mbits of on-chip RAM to support buffering, large-state machines, and data processing tasks.
  • I/O Density — 696 user I/O pins to accommodate wide parallel interfaces and multi-channel connectivity.
  • Power Supply — Core voltage supply specified from 820 mV to 880 mV for compatibility with targeted power domains.
  • Package & Mounting — 1517-BBGA (FCBGA) package, supplier device package 1517-FBGA (40×40), surface-mount for compact board-level integration.
  • Operating Range & Grade — Commercial grade with an operating temperature range of 0 °C to 85 °C.
  • Compliance — RoHS compliant.

Typical Applications

  • High-density custom logic — Implement complex finite-state machines, DSP pipelines, or protocol engines using the device’s large logic capacity.
  • On-chip buffering and memory-centric designs — Use the approximately 39.9 Mbits of embedded RAM for frame buffering, packet queues, or lookup tables.
  • Multi-interface boards — Leverage 696 I/Os to connect to numerous parallel peripherals, sensors, or daughtercards.

Unique Advantages

  • High integration — Large counts of logic elements and embedded RAM consolidate functionality into a single device, reducing system BOM and board area.
  • Extensive I/O — Nearly 700 I/O pins simplify routing for multi-channel and high-pin-count interfaces.
  • Commercial-grade reliability — Specified for 0 °C to 85 °C operation to meet commercial application temperature requirements.
  • Compact FCBGA package — 1517-BBGA (40×40) surface-mount package supports dense PCB integration while preserving thermal and electrical connectivity.
  • Standards-compliant supply — Core voltage supply range (820 mV to 880 mV) aligns with targeted FPGA power domains for predictable operation.

Why Choose 5SGSMD5K3F40C3WN?

The 5SGSMD5K3F40C3WN combines very large logic capacity, substantial on-chip memory, and a high I/O count in a commercial-grade Stratix V GS FPGA package from Intel. Its specifications suit designs that require dense programmable logic, significant embedded RAM, and many external interfaces while maintaining compact board-level integration.

Choose this device when your project demands consolidated digital functionality, reduced component count, and clear, verifiable electrical and thermal operating parameters documented for the Stratix V family.

Request a quote or submit an inquiry to obtain pricing, availability, and ordering details for the 5SGSMD5K3F40C3WN.

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