5SGSMD5K3F40I3N

The 5SGSMD5K3F40I3N is a Stratix® V GS FPGA supplied in a 1517-BBGA (1517-FBGA, 40×40) FCBGA package. It delivers 457,000 logic elements, approximately 39.936 Mbits of embedded memory, and 696 user I/O pins in an industrial-grade package.

This device targets designs that require very high logic density, large on-chip RAM, and extensive I/O capability while operating across an industrial temperature range and a core voltage window of 820 mV to 880 mV.

Key Features

• Core Capacity  457,000 logic elements provide a very high level of programmable logic for complex digital designs.
• Embedded Memory  Approximately 39.936 Mbits of on-chip RAM for data buffering, lookup tables, and algorithm acceleration.
• I/O Density  696 user I/O pins to support extensive peripheral connectivity and board-level interfacing.
• Package  1517-BBGA, FCBGA package (supplier device package: 1517-FBGA, 40×40) suitable for surface-mount PCB assembly.
• Power  Core supply operating range from 820 mV to 880 mV to match system power-rail requirements.
• Thermal and Environmental  Industrial temperature grade with an operating range of −40 °C to 100 °C and RoHS compliance for environmental compatibility.

Typical Applications

• High-density logic integration  Implement large-scale digital functions and custom compute pipelines using 457,000 logic elements.
• Memory-intensive processing  Leverage approximately 39.936 Mbits of embedded RAM for buffering, caching, and on-chip data structures.
• I/O-rich systems  Use the 696 I/O pins to connect numerous peripherals, interfaces, and board-level signals without extensive external logic.
• Industrial deployments  Designed for applications that require operation across −40 °C to 100 °C and industrial-grade reliability.

Unique Advantages

• High integration density: 457,000 logic elements and substantial on-chip RAM reduce the need for external silicon, simplifying board design.
• Extensive connectivity: 696 I/Os enable dense interface routing and minimize off-chip interface components.
• Industrial temperature capability: Rated from −40 °C to 100 °C for use in temperature-challenging environments.
• Compact, manufacturable package: 1517-BBGA (1517-FBGA, 40×40) surface-mount package supports standard PCB assembly processes.
• Controlled core power: Core supply range of 820 mV to 880 mV supports precise power budgeting in system design.
• Regulatory compliance: RoHS-compliant construction supports environmental and supply-chain requirements.

Why Choose 5SGSMD5K3F40I3N?

The 5SGSMD5K3F40I3N provides a blend of very high logic capacity, substantial embedded memory, and a large I/O complement in an industrial-temperature, surface-mount FCBGA package. It is well suited to engineering teams that need to consolidate functions onto a single programmable device while maintaining predictable thermal and power characteristics.

This part is appropriate for designs that prioritize on-chip integration and I/O density, offering scalability and robustness for long-term deployments supported by Stratix V family documentation and device-level specifications.

Request a quote or submit a sales inquiry to evaluate 5SGSMD5K3F40I3N for your next high-density FPGA design.