5SGSMD5K3F40I4

IC FPGA 696 I/O 1517FBGA
Part Description

Stratix® V GS Field Programmable Gate Array (FPGA) IC 696 39936000 457000 1517-BBGA, FCBGA

Quantity 1,512 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1517-FBGA (40x40)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1517-BBGA, FCBGANumber of I/O696Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs172600Number of Logic Elements/Cells457000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits39936000

Overview of 5SGSMD5K3F40I4 – Stratix® V GS FPGA, 696 I/O, 457000 logic elements

The 5SGSMD5K3F40I4 is a Stratix® V GS field programmable gate array (FPGA) IC designed for high-density logic integration and systems requiring large on-chip memory and extensive I/O. This industrial-grade device combines a large logic fabric with substantial embedded RAM and broad I/O connectivity to support complex digital designs.

With 457,000 logic elements, approximately 39.94 Mbits of embedded memory, and 696 I/O pins in a 1517-BBGA (FCBGA) package, the device targets applications that need significant programmable logic, abundant on-chip storage, and robust thermal and voltage operating margins.

Key Features

  • Core Logic – 457,000 logic elements for large-scale integration of custom digital functions and complex state machines.
  • Embedded Memory – Approximately 39.94 Mbits of on-chip RAM for data buffering, packet storage, and local processing without external memory dependency.
  • I/O Capacity – 696 I/O pins to support dense external interfacing and multi-channel connectivity in system-level designs.
  • Package & Mounting – 1517-BBGA (FCBGA) package; supplier device package listed as 1517-FBGA (40×40); surface-mount mounting type for PCB integration.
  • Power – Core supply voltage range specified at 820 mV to 880 mV to match target power delivery and sequencing requirements.
  • Temperature & Grade – Industrial grade device with operating temperature range from -40 °C to 100 °C for use in demanding environments.
  • Regulatory – RoHS compliant.

Typical Applications

  • High-density digital processing – Implement complex logic, protocol processing, and custom accelerators using the large logic-element count and embedded RAM.
  • Multi-channel I/O systems – Handle extensive parallel and serialized interfacing tasks with 696 available I/O pins.
  • Memory-intensive embedded functions – Use the nearly 40 Mbits of on-chip RAM for buffering, lookup tables, and streaming data operations without immediate external memory.
  • Industrial control and communications – Deployed in industrial-temperature environments where extended operating range and surface-mount packaging are required.

Unique Advantages

  • Large programmable fabric: 457,000 logic elements provide capacity for sizable, integrated digital designs that would otherwise require multiple devices.
  • Significant on-chip memory: Approximately 39.94 Mbits of embedded RAM reduces dependence on external memory, lowering BOM complexity and latency.
  • High I/O density: 696 I/O pins enable complex board-level connectivity and simplify multi-channel system designs.
  • Industrial temperature rating: -40 °C to 100 °C operating range supports deployment in a wide variety of temperature-challenging environments.
  • Compact, surface-mount package: 1517-BBGA (FCBGA) package and 1517-FBGA (40×40) supplier footprint offer a high-density solution for space-constrained PCBs.
  • Low-voltage core operation: Specified supply range of 820 mV to 880 mV aligns with modern power-rail architectures and power-optimization strategies.

Why Choose 5SGSMD5K3F40I4?

The 5SGSMD5K3F40I4 positions itself as a high-density Stratix V GS FPGA option for engineers who require extensive programmable logic, substantial embedded memory, and large I/O counts within an industrial temperature envelope. Its combination of 457,000 logic elements, roughly 39.94 Mbits of on-chip RAM, and 696 I/Os in a compact FCBGA package makes it suitable for demanding designs where integration density and thermal/voltage tolerances are important.

This device is appropriate for teams developing complex digital systems that benefit from consolidated logic and memory resources on a single FPGA, reducing board-level component count while providing a scalable platform for iterative development and deployment.

Request a quote or submit a pricing inquiry to receive availability, lead-time, and ordering information for the 5SGSMD5K3F40I4.

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