5SGSMD5K3F40I4WN

IC FPGA 696 I/O 1517FBGA
Part Description

Stratix® V GS Field Programmable Gate Array (FPGA) IC 696 39936000 457000 1517-BBGA, FCBGA

Quantity 1,524 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1517-FBGA (40x40)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1517-BBGA, FCBGANumber of I/O696Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs172600Number of Logic Elements/Cells457000
Number of GatesN/AECCNOBSOLETEHTS CodeN/A
QualificationN/ATotal RAM Bits39936000

Overview of 5SGSMD5K3F40I4WN – Stratix® V GS FPGA, Industrial-Grade 1517-FBGA

The 5SGSMD5K3F40I4WN is a Stratix® V GS field programmable gate array supplied in a 1517-ball FCBGA package and specified for industrial temperature operation. It provides a high logic element count, extensive on-chip memory, and a large number of I/O pins for complex, high-density programmable logic designs.

Designed for industrial applications that require significant programmable logic capacity and robust operating range, this Stratix V GS device delivers a combination of logic density, embedded memory, and I/O capability while operating from a low-voltage core supply.

Key Features

  • Core / Logic  Approximately 457,000 logic elements and 172,600 logic element blocks provide substantial programmable logic resources for large designs.
  • Embedded Memory  Approximately 39.9 Mbits of on-chip RAM to support data buffering, lookup tables, and intermediate storage without external RAM.
  • I/O Capacity  Up to 696 programmable I/O pins to interface with high-pin-count peripherals, external memory, and multi-lane I/O systems.
  • Power / Voltage  Core supply operating range from 820 mV to 880 mV for low-voltage core operation.
  • Package & Mounting  1517-ball FCBGA package (supplier device package: 1517-FBGA, 40×40) in a surface-mount form factor for compact, high-density board designs.
  • Temperature & Grade  Industrial-grade device rated for operation from –40°C to 100°C for extended-environment deployment.
  • Environmental Compliance  RoHS-compliant.

Typical Applications

  • Industrial automation and control  Large logic capacity and industrial temperature rating support complex control algorithms and I/O interfacing in factory and process environments.
  • High-density system integration  High logic element and I/O counts enable consolidation of multiple functions into a single programmable device, reducing board-level BOM and interconnect complexity.
  • Memory-intensive FPGA functions  Approximately 39.9 Mbits of embedded RAM allow substantial on-chip buffering, FIFOs, and local storage for data-path and streaming applications.

Unique Advantages

  • High logic density: Approximately 457,000 logic elements support large-scale PLD implementations and complex algorithms within a single device.
  • Substantial on-chip memory: Roughly 39.9 Mbits of embedded RAM reduces dependence on external memory for many designs, simplifying system architecture.
  • Extensive I/O: 696 I/Os enable broad connectivity to peripherals, sensors, and multi-channel interfaces without external expanders.
  • Industrial operating range: –40°C to 100°C rating supports deployment in harsh or temperature-variable environments.
  • Low-voltage core operation: 0.82–0.88 V core supply range supports designs optimized for low-voltage FPGA cores.
  • High-density FCBGA package: 1517-ball FCBGA (1517-FBGA, 40×40) balances pin count and board footprint for compact system designs.

Why Choose 5SGSMD5K3F40I4WN?

The 5SGSMD5K3F40I4WN combines high logic density, substantial embedded memory, and a large I/O complement in an industrial-temperature Stratix V GS device and a 1517-ball FCBGA package. Its specification of approximately 457,000 logic elements and roughly 39.9 Mbits of on-chip RAM makes it suitable for designs that require consolidation of complex functions and significant local data storage.

This device is suited to engineers and teams building industrial systems and high-density programmable solutions who need a robust, scalable FPGA platform with broad I/O and thermal margin. The combination of device-level resources and industrial-grade operation supports long-term deployment and integration into demanding system environments.

Request a quote or submit an inquiry to receive pricing, lead-time, and availability information for the 5SGSMD5K3F40I4WN.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1968


    Headquarters: Santa Clara, California, USA


    Employees: 130,000+


    Revenue: $54.23 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018


    Featured Products
    Latest News
    keyboard_arrow_up