5SGSMD5K3F40I4N
| Part Description |
Stratix® V GS Field Programmable Gate Array (FPGA) IC 696 39936000 457000 1517-BBGA, FCBGA |
|---|---|
| Quantity | 296 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 1517-FBGA (40x40) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1517-BBGA, FCBGA | Number of I/O | 696 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 172600 | Number of Logic Elements/Cells | 457000 | ||
| Number of Gates | N/A | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 39936000 |
Overview of 5SGSMD5K3F40I4N – Stratix® V GS Field Programmable Gate Array (FPGA) IC 1517-BBGA, FCBGA
The 5SGSMD5K3F40I4N is a Stratix® V GS family FPGA in a 1517-ball FCBGA package, designed for high-density programmable logic implementations. It combines a large logic fabric with substantial embedded memory and a high I/O count to support complex, memory‑intensive designs in industrial environments.
Key technical attributes include approximately 457,000 logic elements, roughly 39.9 Mbits of on-chip RAM, 696 user I/Os, an industrial operating temperature range, and a low-voltage core supply. These specifications make the device suitable where high integration, configurability, and robustness are required.
Key Features
- Core logic capacity — Approximately 457,000 logic elements to implement large custom logic, complex datapaths, and multi-function systems on a single device.
- Embedded memory — Approximately 39.9 Mbits of on-chip RAM for buffering, lookup tables, and memory‑intensive accelerators without external memory dependency.
- High I/O count — 696 I/Os to support dense interfacing, wide parallel buses, and multiple peripheral connections from a single FPGA.
- Package and mounting — 1517-BBGA (FCBGA) in a 1517-FBGA (40×40) supplier package, optimized for surface-mount PCB assembly and compact system integration.
- Power and core voltage — Core supply range of 820 mV to 880 mV, enabling low-voltage operation for the programmable fabric.
- Industrial temperature grade — Rated for operation from −40 °C to 100 °C for deployment in temperature‑challenging environments.
Typical Applications
- Industrial control and automation — Implements complex control logic, motion control, and machine interfacing where industrial temperature operation and high integration are required.
- High-density signal processing — Suitable for DSP and accelerator functions that benefit from large logic capacity and substantial on-chip RAM.
- Embedded system integration — Consolidates multiple system functions and I/O requirements into a single FPGA to reduce board count and simplify designs.
Unique Advantages
- High integration density: Large logic element count and significant embedded RAM enable consolidation of complex subsystems onto one device, reducing BOM and board complexity.
- Broad I/O capability: 696 I/Os allow extensive peripheral connectivity and wide parallel interfaces for demanding system architectures.
- Industrial robustness: Industrial-grade specification with −40 °C to 100 °C operation supports designs deployed in harsh or wide-range temperature environments.
- Compact FCBGA package: 1517-ball FCBGA in a 40×40 supplier package provides a space-efficient form factor for high-pin-count applications.
- Low-voltage core operation: 820–880 mV supply range helps manage power distribution for high-density FPGA fabrics.
Why Choose 5SGSMD5K3F40I4N?
The 5SGSMD5K3F40I4N positions itself as a high-capacity Stratix V GS FPGA tailored for designs that demand extensive logic resources, on-chip memory, and a large number of I/Os within an industrial temperature envelope. Its combination of approximately 457,000 logic elements, roughly 39.9 Mbits of embedded RAM, and 696 I/Os delivers the integration needed to streamline complex system designs onto a single programmable device.
Engineers and procurement teams seeking a robust, compact FPGA solution for industrial and high-density embedded applications will find this device aligns with requirements for performance, integration, and environmental resilience while simplifying board-level design and system architecture.
Request a quote or submit a product inquiry to receive pricing, availability, and lead‑time details for the 5SGSMD5K3F40I4N.

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