5SGSMD6K1F40C2G

The 5SGSMD6K1F40C2G is a Stratix V GS field-programmable gate array (FPGA) in a 1517-ball FCBGA package. It delivers a large programmable fabric with 583,000 logic elements and approximately 46 Mbits of embedded memory for designs that require high logic density and substantial on-chip RAM.

With up to 696 user I/Os, a supply voltage range of 870 mV to 930 mV, and commercial temperature grading (0 °C to 85 °C), this device targets I/O‑dense and compute‑intensive applications where integration, configurability, and RoHS compliance are required.

Key Features

• Core Architecture Stratix® V GS FPGA family architecture providing a high-density programmable fabric with 583,000 logic elements.
• Logic Array Capacity 220,000 logic array blocks to support complex logic implementations and deep custom pipelines.
• Embedded Memory Approximately 46 Mbits of on-chip RAM for buffering, packet queues, and local data storage.
• High I/O Count Up to 696 I/Os to support wide bus interfaces, multiple peripherals, and dense board-level integration.
• Package and Mounting 1517-BBGA (FCBGA) package; supplier device package listed as 1517-FBGA (40×40). Surface-mount device suitable for compact board layouts.
• Power and Supply Core supply voltage range of 870 mV to 930 mV for precise power budgeting and system-level power design.
• Temperature Grade Commercial grade operation with an operating temperature range of 0 °C to 85 °C.
• Environmental Compliance RoHS compliant.
• Series Documentation Device electrical and switching characteristics, I/O timing, and transceiver speed grade information are documented in the Stratix V device datasheet.

Typical Applications

• I/O‑Dense Systems — Leverage up to 696 I/Os for board-level bridging, wide parallel interfaces, and multi‑lane connectivity in complex systems.
• High‑Density Logic Implementations — Use the 583,000 logic elements and 220,000 logic array blocks for custom accelerators, protocol engines, and large combinational/sequential logic designs.
• On‑Chip Data Buffering — Approximately 46 Mbits of embedded memory supports buffering, FIFO storage, and intermediate data aggregation without immediate reliance on external memory.
• Prototyping and System Integration — Surface-mount FCBGA package and commercial temperature grade suit development and production systems requiring high integration.

Unique Advantages

• High Logic Density: 583,000 logic elements enable complex functions and large-scale integration within a single device, simplifying system architecture.
• Substantial On‑Chip RAM: Approximately 46 Mbits of embedded memory reduces dependencies on external memory for many buffering and storage tasks.
• Extensive I/O Resources: 696 I/Os provide flexibility to interface with multiple peripherals, buses, and external devices directly from the FPGA.
• Compact, Surface‑Mount Package: 1517-FBGA (40×40) form factor allows dense PCB placement while maintaining high pin count and signal routing options.
• Controlled Core Supply Window: 870 mV to 930 mV supply range supports predictable power design and integration into regulated power domains.
• Commercial Temperature and RoHS Compliance: 0 °C to 85 °C operating range and RoHS compliance support standard commercial deployments and regulatory requirements.

Why Choose 5SGSMD6K1F40C2G?

The 5SGSMD6K1F40C2G positions itself as a high-density, I/O-rich Stratix V GS FPGA suitable for systems that require significant programmable logic, substantial on‑chip memory, and numerous external interfaces. Its combination of 583,000 logic elements, approximately 46 Mbits of embedded RAM, and 696 I/Os makes it well suited for designers who need to consolidate functions into a single, configurable device.

Supported by comprehensive Stratix V device documentation, this device provides engineers with the electrical and timing data needed for integration, power budgeting, and performance planning in commercial-temperature applications.

Request a quote or submit a pricing inquiry to evaluate the 5SGSMD6K1F40C2G for your next design.