5SGSMD6K1F40I2G
| Part Description |
Stratix® V GS Field Programmable Gate Array (FPGA) IC 696 46080000 583000 1517-BBGA, FCBGA |
|---|---|
| Quantity | 1,536 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1517-FBGA (40x40) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1517-BBGA, FCBGA | Number of I/O | 696 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 220000 | Number of Logic Elements/Cells | 583000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 46080000 |
Overview of 5SGSMD6K1F40I2G – Stratix V GS Field Programmable Gate Array (FPGA)
The 5SGSMD6K1F40I2G is a Stratix® V GS Field Programmable Gate Array (FPGA) IC delivering high logic density and substantial on-chip memory for demanding embedded designs. Built in a 1517-BBGA FCBGA package with surface-mount assembly, this industrial-grade device combines a large number of logic elements and I/O capacity with explicit electrical and thermal operating ranges for robust deployment.
Key attributes include approximately 583,000 logic elements, approximately 46.08 Mbits of embedded RAM, and 696 user I/Os, making the device suitable for applications that require dense logic implementation and significant on-chip memory resources.
Key Features
- Core Logic Approximately 583,000 logic elements to support complex, high-density logic designs.
- Embedded Memory Approximately 46.08 Mbits of on-chip RAM for large buffering, lookup tables, and algorithm state storage.
- I/O Capacity 696 total I/Os to enable extensive interfacing and system integration.
- Package & Mounting 1517-BBGA (FCBGA) package, supplier device package 1517-FBGA (40×40), designed for surface-mount assembly.
- Power Supply Core voltage specified from 870 mV to 930 mV, allowing precise power budgeting and regulator selection.
- Temperature Grade Industrial grade with an operating temperature range of −40 °C to 100 °C for extended-environment use.
- Compliance RoHS compliant, meeting common lead-free environmental requirements.
Typical Applications
- High-density digital processing Implement complex combinational and sequential logic using the device’s large pool of logic elements.
- On-chip memory–intensive functions Use approximately 46.08 Mbits of embedded RAM for buffering, packet processing, or large LUT-based algorithms.
- Multi-I/O integration Leverage 696 I/Os to interface with multiple subsystems, peripherals, or high-pin-count daughtercards.
Unique Advantages
- High logic density: Approximately 583,000 logic elements enable consolidation of complex functions into a single FPGA, reducing external component count.
- Significant on-chip memory: Approximately 46.08 Mbits of RAM supports larger internal data structures and reduces dependence on external memory.
- Extensive I/O: 696 I/Os allow flexible system connectivity and simplify board-level routing for multi-interface designs.
- Industrial temperature rating: −40 °C to 100 °C operating range supports deployment in environments with wide temperature variation.
- Compact BGA package: 1517-BBGA (40×40) FCBGA provides a high-pin-count footprint in a compact, surface-mount form factor.
- Regulated core voltage range: Defined 870 mV–930 mV supply window enables predictable power design and thermal planning.
Why Choose 5SGSMD6K1F40I2G?
The 5SGSMD6K1F40I2G positions itself as a high-density Stratix V GS FPGA option for designs that require a large logic fabric, substantial embedded RAM, and broad I/O bandwidth within a compact BGA package. Its industrial temperature rating and RoHS compliance support robust, environmentally conscious product designs.
Engineers and procurement teams will find the part appropriate for consolidating complex functions onto a single device while retaining predictable power and thermal parameters. The combination of logic capacity, embedded memory, and I/O count delivers scalability for advanced FPGA-based systems.
Request a quote or submit a product inquiry to obtain pricing, availability, and technical assistance for integrating the 5SGSMD6K1F40I2G into your design workflow.

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