5SGSMD6K1F40I2G

IC FPGA 696 I/O 1517FBGA
Part Description

Stratix® V GS Field Programmable Gate Array (FPGA) IC 696 46080000 583000 1517-BBGA, FCBGA

Quantity 1,536 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package1517-FBGA (40x40)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1517-BBGA, FCBGANumber of I/O696Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs220000Number of Logic Elements/Cells583000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits46080000

Overview of 5SGSMD6K1F40I2G – Stratix V GS Field Programmable Gate Array (FPGA)

The 5SGSMD6K1F40I2G is a Stratix® V GS Field Programmable Gate Array (FPGA) IC delivering high logic density and substantial on-chip memory for demanding embedded designs. Built in a 1517-BBGA FCBGA package with surface-mount assembly, this industrial-grade device combines a large number of logic elements and I/O capacity with explicit electrical and thermal operating ranges for robust deployment.

Key attributes include approximately 583,000 logic elements, approximately 46.08 Mbits of embedded RAM, and 696 user I/Os, making the device suitable for applications that require dense logic implementation and significant on-chip memory resources.

Key Features

  • Core Logic  Approximately 583,000 logic elements to support complex, high-density logic designs.
  • Embedded Memory  Approximately 46.08 Mbits of on-chip RAM for large buffering, lookup tables, and algorithm state storage.
  • I/O Capacity  696 total I/Os to enable extensive interfacing and system integration.
  • Package & Mounting  1517-BBGA (FCBGA) package, supplier device package 1517-FBGA (40×40), designed for surface-mount assembly.
  • Power Supply  Core voltage specified from 870 mV to 930 mV, allowing precise power budgeting and regulator selection.
  • Temperature Grade  Industrial grade with an operating temperature range of −40 °C to 100 °C for extended-environment use.
  • Compliance  RoHS compliant, meeting common lead-free environmental requirements.

Typical Applications

  • High-density digital processing  Implement complex combinational and sequential logic using the device’s large pool of logic elements.
  • On-chip memory–intensive functions  Use approximately 46.08 Mbits of embedded RAM for buffering, packet processing, or large LUT-based algorithms.
  • Multi-I/O integration  Leverage 696 I/Os to interface with multiple subsystems, peripherals, or high-pin-count daughtercards.

Unique Advantages

  • High logic density: Approximately 583,000 logic elements enable consolidation of complex functions into a single FPGA, reducing external component count.
  • Significant on-chip memory: Approximately 46.08 Mbits of RAM supports larger internal data structures and reduces dependence on external memory.
  • Extensive I/O: 696 I/Os allow flexible system connectivity and simplify board-level routing for multi-interface designs.
  • Industrial temperature rating: −40 °C to 100 °C operating range supports deployment in environments with wide temperature variation.
  • Compact BGA package: 1517-BBGA (40×40) FCBGA provides a high-pin-count footprint in a compact, surface-mount form factor.
  • Regulated core voltage range: Defined 870 mV–930 mV supply window enables predictable power design and thermal planning.

Why Choose 5SGSMD6K1F40I2G?

The 5SGSMD6K1F40I2G positions itself as a high-density Stratix V GS FPGA option for designs that require a large logic fabric, substantial embedded RAM, and broad I/O bandwidth within a compact BGA package. Its industrial temperature rating and RoHS compliance support robust, environmentally conscious product designs.

Engineers and procurement teams will find the part appropriate for consolidating complex functions onto a single device while retaining predictable power and thermal parameters. The combination of logic capacity, embedded memory, and I/O count delivers scalability for advanced FPGA-based systems.

Request a quote or submit a product inquiry to obtain pricing, availability, and technical assistance for integrating the 5SGSMD6K1F40I2G into your design workflow.

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