5SGSMD6K1F40I2N

The 5SGSMD6K1F40I2N is a Stratix® V GS field-programmable gate array (FPGA) IC from Intel. This device provides high logic density with 583,000 logic elements and substantial on-chip memory, making it suitable for designs that require large programmable logic resources and embedded RAM.

Packaged in a 1517-BBGA FCBGA (1517-FBGA, 40×40) surface-mount package, the device targets industrial-grade applications with a specified operating temperature range of –40 °C to 100 °C and RoHS compliance.

Key Features

• Core Logic  583,000 logic elements for complex digital designs and high-density programmable logic.
• Embedded Memory  Approximately 46.08 Mbits of on-chip RAM to support large buffers, lookup tables, and memory-intensive algorithms.
• I/O Capacity  696 general-purpose I/O pins to accommodate wide parallel interfaces and multiple high-pin-count peripherals.
• Power Supply  Core supply voltage range of 870 mV to 930 mV for the device core power domain.
• Package & Mounting  1517-BBGA (FCBGA) with supplier package 1517-FBGA (40×40); surface-mount package suitable for compact, high-density PCB layouts.
• Industrial Grade & Temperature  Rated industrial grade with an operating temperature range of –40 °C to 100 °C for use in temperature-challenging environments.
• Standards Compliance  RoHS-compliant construction for regulatory and environmental requirements.

Typical Applications

• High-density digital systems  Leverage 583,000 logic elements and extensive on-chip RAM to implement complex custom logic and protocol processing.
• Interface aggregation and bridging  The 696 I/O pins enable consolidation of multiple parallel interfaces and high-pin-count connectivity on a single FPGA.
• Industrial control and automation  Industrial temperature grade (–40 °C to 100 °C) and robust packaging make the device suitable for industrial controllers and automation systems.

Unique Advantages

• High integration density: Large logic element count and significant embedded RAM reduce the need for external logic and memory, simplifying BOM and board layout.
• Flexible I/O support: 696 I/Os provide headroom for multiple interfaces and sensors without additional off-board glue logic.
• Industrial temperature capability: Rated for –40 °C to 100 °C operation to meet requirements in harsh ambient conditions.
• Compact FCBGA package: 1517-BBGA (1517-FBGA 40×40) enables high-density placement while supporting surface-mount manufacturing.
• Regulatory compliance: RoHS-compliant manufacturing aligns with environmental and regulatory constraints.
• Deterministic core power range: Specified 870 mV to 930 mV core supply provides a defined platform for power budgeting and thermal planning.

Why Choose 5SGSMD6K1F40I2N?

The 5SGSMD6K1F40I2N combines a high logic element count, substantial embedded memory, and a large I/O complement in an industrial-grade FCBGA package—offering a compact, high-capacity FPGA platform for demanding designs. Its specified operating temperature range and RoHS compliance make it suitable for long-life, field-deployed equipment where robustness and regulatory alignment matter.

This device is appropriate for engineering teams building high-density programmable logic solutions that require on-chip RAM and broad I/O connectivity, while maintaining a controlled power and thermal envelope thanks to the defined core supply range.

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