5SGSMD5K3F40M4

IC FPGA 172600 I/O 1517FBGA
Part Description

Stratix® V GS Field Programmable Gate Array (FPGA) IC 172600 46769152 690400 1517-BBGA, FCBGA

Quantity 394 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1517-FBGA (40x40)GradeMilitaryOperating Temperature-40°C – 125°C
Package / Case1517-BBGA, FCBGANumber of I/O696Voltage820 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs457000Number of Logic Elements/Cells690400
Number of GatesN/AECCNOBSOLETEHTS CodeN/A
QualificationN/ATotal RAM Bits46769152

Overview of 5SGSMD5K3F40M4 – Stratix® V GS FPGA, Military-Grade FCBGA

The 5SGSMD5K3F40M4 is a Stratix V GS family Field Programmable Gate Array (FPGA) IC from Intel, supplied in a high-density 1517-BBGA FCBGA package. It delivers very large programmable logic capacity, extensive I/O, and substantial embedded memory for complex, military-grade designs that require robust operating range and high integration.

Designed for applications that need significant on-chip resources, this device combines hundreds of thousands of logic elements with tens of megabits of embedded RAM and a broad I/O footprint, while operating at a low core voltage and a wide temperature range.

Key Features

  • High Logic Capacity — 690,400 logic elements to implement large-scale programmable logic, custom datapaths, and complex control functions.
  • Substantial Embedded Memory — Approximately 46.8 Mbits of on-chip RAM to support buffering, lookup tables, and local data storage.
  • Extensive I/O — 696 I/O pins for wide system connectivity and flexible interface routing.
  • Power and Core Voltage — Core supply range from 820 mV to 930 mV to support the device's high-performance logic fabric.
  • Packaging & Mounting — 1517-BBGA FCBGA package (supplier device package: 1517-FBGA, 40×40) with surface-mount mounting for compact board integration.
  • Temperature & Grade — Military grade with an operating temperature range of −40 °C to 125 °C for demanding environmental conditions.
  • Standards Compliance — RoHS compliant.

Typical Applications

  • High-density signal processing — Implement complex DSP algorithms and custom accelerators using the large logic and memory resources.
  • Communications and networking — Support wide parallel interfaces and protocol implementations with abundant I/O and embedded RAM.
  • Military and ruggedized systems — Deploy in systems that require military-grade components and an extended operating temperature range.
  • Platform integration and prototyping — Use the device for system-level integration where high logic capacity and numerous I/Os reduce external components.

Unique Advantages

  • Highly integrated logic and memory: 690,400 logic elements combined with approximately 46.8 Mbits of embedded RAM reduce external memory needs and simplify board design.
  • Large I/O count: 696 I/Os allow flexible interfacing to multiple subsystems without complex multiplexing.
  • Military-grade thermal range: Rated from −40 °C to 125 °C to meet demanding environment requirements.
  • Low-voltage core operation: 820 mV–930 mV core supply supports efficient, high-density logic operation.
  • Dense, surface-mount BGA package: 1517-BBGA/1517-FBGA (40×40) package enables compact PCB designs and high I/O density.
  • RoHS compliant: Aligns with environmental and regulatory requirements for lead-free designs.

Why Choose 5SGSMD5K3F40M4?

The 5SGSMD5K3F40M4 positions itself as a high-capacity Stratix V GS FPGA option for designs that demand substantial on-chip logic, embedded memory, and wide I/O capability within a military-grade thermal envelope. Its combination of nearly 700k logic elements, tens of megabits of RAM, and nearly 700 I/Os supports consolidation of functions and reductions in system BOM.

This device is suited to engineering teams developing complex, ruggedized systems where integration, reliability, and long-term scalability are priorities. The package and electrical specifications facilitate dense board-level integration while supporting designs that operate across a broad temperature range.

Request a quote or submit a procurement inquiry to begin sourcing the 5SGSMD5K3F40M4 for your next high-density FPGA design.

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