5SGSMD5K3F40I4G

IC FPGA 696 I/O 1517FBGA
Part Description

Stratix® V GS Field Programmable Gate Array (FPGA) IC 696 39936000 457000 1517-BBGA, FCBGA

Quantity 1,827 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package1517-FBGA (40x40)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1517-BBGA, FCBGANumber of I/O696Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs172600Number of Logic Elements/Cells457000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits39936000

Overview of 5SGSMD5K3F40I4G – Stratix V GS FPGA, 1517-BBGA FCBGA

The 5SGSMD5K3F40I4G is a Stratix® V GS field-programmable gate array (FPGA) IC in a 1517-BBGA FCBGA package. It delivers a high-density programmable fabric with a substantial on-chip memory footprint and extensive I/O for complex, high-capacity designs.

Designed and documented within the Stratix V family, this industrial-grade device targets projects that require large logic capacity, significant embedded memory, and wide operating temperature capability while operating from a low core voltage.

Key Features

  • Logic Capacity — 457,000 logic elements, enabling very large programmable logic implementations.
  • Embedded Memory — Approximately 39.9 Mbits of total on-chip RAM to support buffers, FIFOs, and algorithm state storage.
  • High I/O Count — 696 user I/O pins for extensive external connectivity and interface integration.
  • Power/Core Voltage — Core supply range of 820 mV to 880 mV to match low-voltage system architectures.
  • Package — 1517-BBGA, FCBGA package (supplier device package: 1517-FBGA, 40×40) for high-density board integration.
  • Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C, suitable for robust environments.
  • RoHS Compliant — Meets RoHS environmental requirements.

Typical Applications

  • High-density programmable logic systems — Leverage 457,000 logic elements and extensive embedded memory to implement large custom logic, signal processing, or algorithm acceleration.
  • I/O-intensive designs — Use 696 I/O pins for multi-channel interfacing, complex bus implementations, and dense peripheral connectivity.
  • Industrial deployments — Industrial grade device and −40 °C to 100 °C operating range for applications that require broader temperature tolerance and reliability.

Unique Advantages

  • Highly integrated programmable fabric: Large logic element count and substantial on-chip RAM reduce the need for external logic and memory components.
  • Extensive external connectivity: 696 I/O pins enable integration of many interfaces without sacrificing pin availability.
  • Compact, high-density package: The 1517-BBGA (1517-FBGA, 40×40) package supports dense PCB layouts while providing the connections required for complex systems.
  • Low-voltage core operation: 820 mV–880 mV core supply aligns with modern low-voltage power domains.
  • Designed for robust environments: Industrial temperature rating and RoHS compliance support deployment in demanding conditions with environmental considerations addressed.

Why Choose 5SGSMD5K3F40I4G?

The 5SGSMD5K3F40I4G positions itself as a high-capacity Stratix V GS FPGA option for engineers needing a combination of large logic resources, significant on-chip memory, and a high I/O count in an industrial-grade package. Its low core voltage and compact 1517-BBGA footprint make it suitable for dense, power-conscious designs that must operate across a wide temperature range.

Backed by the Stratix V device documentation and vendor support, this device is appropriate for teams building scalable, long-lived programmable solutions that require verifiable specifications and robust operating margins.

If you require pricing, availability, or a formal quote for 5SGSMD5K3F40I4G, submit a request to receive detailed procurement and technical support information.

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