5SGSMD8K2F40C2LG

IC FPGA 696 I/O 1517FBGA
Part Description

Stratix® V GS Field Programmable Gate Array (FPGA) IC 696 51200000 695000 1517-BBGA, FCBGA

Quantity 1,290 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package1517-FBGA (40x40)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1517-BBGA, FCBGANumber of I/O696Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs262400Number of Logic Elements/Cells695000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits51200000

Overview of 5SGSMD8K2F40C2LG – Stratix V GS FPGA, 695,000 logic elements, ~51.2 Mbits RAM, 696 I/Os

The 5SGSMD8K2F40C2LG is a Stratix® V GS field programmable gate array (FPGA) manufactured by Intel. This commercial‑grade, surface‑mount FCBGA device delivers high logic capacity and substantial on‑chip memory in a 1517‑FBGA (40×40) package, suited for complex digital integration where large programmable logic and abundant I/O are required.

Designed for applications that need significant programmable resources, the device pairs a large logic fabric with extensive I/O and a low-voltage core supply range to support dense, high‑integration system designs.

Key Features

  • Core Logic  695,000 logic elements provide extensive programmable resources for complex digital functions and custom logic implementations.
  • Embedded Memory  Approximately 51.2 Mbits of on‑chip RAM supports large buffers, FIFOs, and data‑intensive processing without external memory for many use cases.
  • I/O Density  696 user I/Os enable broad external device interfacing and high channel counts for parallel data paths and system connectivity.
  • Power and Supply  Core voltage supply operates between 820 mV and 880 mV, allowing integration into low‑voltage systems with defined core power rails.
  • Package & Mounting  1517‑BBGA (FCBGA) package, supplier device package 1517‑FBGA (40×40), surface‑mount mounting type for compact board footprints and high‑density assembly.
  • Operating Range & Grade  Commercial grade with operating temperature range of 0 °C to 85 °C, suitable for standard commercial deployments.
  • RoHS Compliance  Device is RoHS compliant, supporting regulatory requirements for lead‑free assembly.

Typical Applications

  • High‑density digital processing  Use the large logic capacity and embedded memory to implement complex data paths, custom accelerators, and multi‑lane processing engines.
  • Multi‑channel I/O aggregation  Leverage 696 I/Os for designs requiring many parallel interfaces, sensor arrays, or multiport communications hubs.
  • System integration and prototyping  Deploy the device as a programmable integration hub to consolidate custom logic, glue logic, and on‑chip storage in a single package.

Unique Advantages

  • Large programmable fabric: 695,000 logic elements enable high functional density and permit implementation of sizable custom logic blocks on a single device.
  • Substantial embedded memory: Approximately 51.2 Mbits of on‑chip RAM reduces dependence on external memory for many buffering and caching needs, simplifying board design.
  • Extensive I/O availability: 696 I/Os provide flexibility for complex interfacing, parallel data acquisition, and multi‑channel communications.
  • Compact FCBGA package: 1517‑FBGA (40×40) packaging allows high‑density board integration while supporting surface‑mount assembly processes.
  • Commercial operating envelope: Rated for 0 °C to 85 °C and RoHS compliant, fitting standard commercial applications and manufacturing requirements.

Why Choose 5SGSMD8K2F40C2LG?

The 5SGSMD8K2F40C2LG positions itself as a high‑capacity, commercial‑grade FPGA option within the Stratix V GS family, combining a large logic count, substantial embedded memory, and abundant I/O in a compact FCBGA package. It is well suited for designers who require significant on‑chip resources to consolidate functionality and reduce external component count.

Backed by Intel’s Stratix V family documentation and device lineage, this device offers a clear upgrade path for projects that prioritize logic density, on‑chip memory, and flexible I/O while remaining within commercial temperature and supply constraints.

Request a quote or submit an inquiry to receive pricing and availability details for the 5SGSMD8K2F40C2LG and to discuss how it can fit your next project.

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