5SGSMD8K2F40C3G

IC FPGA 696 I/O 1517FBGA
Part Description

Stratix® V GS Field Programmable Gate Array (FPGA) IC 696 51200000 695000 1517-BBGA, FCBGA

Quantity 284 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package1517-FBGA (40x40)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1517-BBGA, FCBGANumber of I/O696Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs262400Number of Logic Elements/Cells695000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits51200000

Overview of 5SGSMD8K2F40C3G – Stratix® V GS FPGA, 695,000 logic elements

The 5SGSMD8K2F40C3G is a Stratix® V GS field-programmable gate array (FPGA) from Intel, designed for high-density programmable logic and embedded memory integration. With 695,000 logic elements and substantial on-chip RAM, this device targets designs that require large logic capacity, wide I/O count, and compact surface-mount packaging.

Key Features

  • Core Logic  695,000 logic elements provide the programmable fabric necessary for complex logic, datapath, and control implementations.
  • Embedded Memory  Approximately 51.2 Mbits of total on-chip RAM to support buffers, lookup tables, and local data storage.
  • I/O Capacity  696 user I/Os to accommodate high-port-count interfaces and extensive peripheral connectivity.
  • Power Supply  Core voltage supply range of 820 mV to 880 mV for the device core power domain.
  • Package & Mounting  1517-BBGA (FCBGA) package, supplier device package 1517-FBGA (40×40), designed for surface-mount assembly.
  • Temperature & Grade  Commercial grade with an operating temperature range of 0 °C to 85 °C.
  • Environmental Compliance  RoHS compliant.

Typical Applications

  • High-density programmable logic systems  Systems that require substantial LUT and routing resources for complex digital functions.
  • Memory-intensive designs  Applications needing significant on-chip RAM for buffering, caching, or local data processing.
  • High I/O-count platforms  Designs that demand many parallel interfaces or extensive signaling between subsystems.

Unique Advantages

  • High logic density: 695,000 logic elements enable consolidation of large logic functions into a single device.
  • Substantial embedded memory: Approximately 51.2 Mbits of on-chip RAM reduces reliance on external memory for many buffering and caching tasks.
  • Extensive I/O support: 696 I/Os provide broad connectivity for multi-channel and multi-protocol implementations.
  • Compact, surface-mount packaging: 1517-BBGA (FCBGA) package and 1517-FBGA (40×40) supplier package allow high-density board integration.
  • Low-voltage core operation: Core supply range of 820 mV to 880 mV supports the device’s power domain requirements.
  • Commercial-grade operating range: Rated for 0 °C to 85 °C to meet standard commercial application environments.

Why Choose 5SGSMD8K2F40C3G?

The 5SGSMD8K2F40C3G delivers a combination of large programmable logic capacity, significant embedded memory, and high I/O count in a compact surface-mount FCBGA package. As part of the Stratix V GS family from Intel, this device is positioned for designs that require dense logic integration and substantial on-chip resources while remaining within commercial temperature and supply specifications.

This part is well suited to engineers and procurement teams building systems that consolidate complex digital functions and local memory on a single FPGA, reducing board complexity and external component count.

Request a quote or submit an inquiry to obtain pricing, availability, and lead-time details for 5SGSMD8K2F40C3G.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1968


    Headquarters: Santa Clara, California, USA


    Employees: 130,000+


    Revenue: $54.23 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018


    Featured Products
    Latest News
    keyboard_arrow_up