5SGSMD8K2F40I2LG
| Part Description |
Stratix® V GS Field Programmable Gate Array (FPGA) IC 696 51200000 695000 1517-BBGA, FCBGA |
|---|---|
| Quantity | 214 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1517-FBGA (40x40) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1517-BBGA, FCBGA | Number of I/O | 696 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 262400 | Number of Logic Elements/Cells | 695000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 51200000 |
Overview of 5SGSMD8K2F40I2LG – Stratix V GS FPGA, 695000 logic elements, 1517-BBGA (FCBGA)
The 5SGSMD8K2F40I2LG is a Stratix® V GS Field Programmable Gate Array (FPGA) in a 1517-BBGA FCBGA package, designed for industrial-grade electronic systems. It is part of the Stratix V family and provides high logic capacity, substantial on-chip RAM, and extensive I/O capability for complex digital designs.
Key design attributes include approximately 695,000 logic elements, roughly 51.2 Mbits of embedded memory, 696 I/Os, and a low-voltage core supply range (820 mV to 880 mV). The device is specified for surface-mount installation and rated for industrial operating temperatures (−40 °C to 100 °C).
Key Features
- Core & Logic Approximately 695,000 logic elements to implement large, complex digital designs and custom compute blocks.
- Embedded Memory Approximately 51.2 Mbits of on-chip RAM to support buffering, packet processing, and on-device storage.
- I/O Capacity 696 I/O pins for wide connectivity to peripherals, high-density interfaces, and multi-channel systems.
- Power Core voltage supply specified from 820 mV to 880 mV, allowing integration with modern low-voltage power architectures.
- Package & Mounting 1517-BBGA (FCBGA) package, supplier device package listed as 1517-FBGA (40×40), optimized for surface-mount assembly.
- Temperature & Grade Industrial grade device with operating temperature range of −40 °C to 100 °C for deployment in demanding environments.
- Regulatory Compliance RoHS compliant for adherence to common environmental standards in electronic manufacturing.
Typical Applications
- Industrial Control & Automation High I/O count and industrial temperature rating make this FPGA suitable for complex control systems and real-time automation tasks.
- High‑Density Logic & Signal Processing Large logic capacity and substantial embedded RAM support dense custom processing pipelines and algorithm acceleration.
- Networking and Data Handling Ample I/Os and on-chip memory allow implementation of multi-channel packet processing, protocol bridging, and data aggregation functions.
Unique Advantages
- High logic density: Approximately 695,000 logic elements enable implementation of large-scale, integration-dense designs without multi-chip partitioning.
- Significant embedded memory: Roughly 51.2 Mbits of on-chip RAM reduces external memory dependency and shortens data paths for latency-sensitive functions.
- Extensive I/O capability: 696 I/Os provide flexibility for multi-interface systems and high channel counts.
- Industrial temperature rating: Specified operation from −40 °C to 100 °C supports deployment in harsh and temperature-variable environments.
- Compact FCBGA package: 1517-BBGA (1517-FBGA, 40×40) surface-mount package balances density and board-level integration for space-constrained designs.
- RoHS compliant: Meets common environmental requirements for modern electronic manufacturing.
Why Choose 5SGSMD8K2F40I2LG?
The 5SGSMD8K2F40I2LG positions itself as a high-capacity, industrial-grade FPGA within the Stratix V family, combining large logic and memory resources with very high I/O density and a low-voltage core. It is well suited for system designers who require on-chip resources to realize complex digital systems while maintaining strict temperature and mounting requirements.
For projects that demand scalability, robust operation in industrial environments, and the integration advantages of a high-density Stratix V device, this part offers a combination of resources and packaging engineered for demanding applications.
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