5SGSMD8K2F40I3G

The 5SGSMD8K2F40I3G is an Intel Stratix® V GS field programmable gate array (FPGA) supplied in a 1517-BBGA FCBGA package. It delivers very large programmable logic capacity, substantial on-chip RAM, and a high channel I/O count for designs that require dense logic integration and extensive connectivity.

Packaged for surface-mount assembly and rated to an industrial temperature range, this device targets applications that need high logic density, significant embedded memory, and a large number of I/O pins within a compact FCBGA footprint.

Key Features

• Programmable Logic Capacity Approximately 695,000 logic elements for complex digital designs and large-scale integration.
• Embedded Memory Approximately 51.2 Mbits of on-chip RAM to support buffering, FIFOs, and memory-intensive functions.
• High I/O Count 696 user I/O pins to support broad interfacing requirements and parallel connectivity.
• Power and Core Voltage Core voltage supply range from 820 mV to 880 mV for the device core domain.
• Package and Mounting 1517-BBGA (FCBGA) package; supplier device package listed as 1517-FBGA (40×40). Surface-mount mounting type.
• Temperature and Grade Industrial grade device with an operating temperature range of −40 °C to 100 °C.
• Environmental Compliance RoHS compliant.

Typical Applications

• High-density FPGA designs — Systems that require extensive programmable logic and large on-chip memory for complex algorithms and processing pipelines.
• High-I/O systems — Designs needing many external interfaces or parallel connections, enabled by the 696 available I/O pins.
• Industrial embedded systems — Applications operating across −40 °C to 100 °C where industrial-grade temperature tolerance is required.

Unique Advantages

• High logic integration: Approximately 695,000 logic elements reduce the need for multiple devices in large designs.
• Substantial on-chip memory: Approximately 51.2 Mbits of embedded RAM supports memory-hungry functions without external memory.
• Extensive I/O capacity: 696 I/O pins provide flexibility for complex interfacing and parallel data paths.
• Industrial temperature rating: Operation from −40 °C to 100 °C supports deployment in demanding environments.
• Compact FCBGA package: 1517-BBGA footprint offers dense integration for space-constrained PCBs.
• Low-voltage core: Core supply between 820 mV and 880 mV aligns with modern low-voltage FPGA power domains.

Why Choose 5SGSMD8K2F40I3G?

The 5SGSMD8K2F40I3G combines very high logic capacity, significant embedded memory, and a large I/O complement in a compact 1517-BBGA FCBGA package. Its industrial temperature rating and RoHS compliance make it suitable for long-lived, environmentally conscious designs that require robust programmable logic resources.

This device is appropriate for customers designing large-scale FPGA systems that need dense logic, on-chip RAM, and extensive external connectivity while maintaining a compact board footprint and industrial temperature tolerance.

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