5SGSMD8K2F40I3LN

IC FPGA 696 I/O 1517FBGA
Part Description

Stratix® V GS Field Programmable Gate Array (FPGA) IC 696 51200000 695000 1517-BBGA, FCBGA

Quantity 696 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1517-FBGA (40x40)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1517-BBGA, FCBGANumber of I/O696Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs262400Number of Logic Elements/Cells695000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits51200000

Overview of 5SGSMD8K2F40I3LN – Stratix® V GS FPGA, 695,000 logic elements, 1517-BBGA

The 5SGSMD8K2F40I3LN is a Stratix® V GS Field Programmable Gate Array (FPGA) IC in a 1517-BBGA FCBGA package. It offers a large programmable logic fabric and substantial on-chip memory tailored for industrial-grade applications that require high logic capacity and extensive I/O.

Key characteristics of this device include approximately 695,000 logic elements, roughly 51.2 Mbits of embedded memory, 696 I/O pins, and an industrial operating temperature range. The device is designed for surface-mount assembly and operates from a core supply in the 820 mV to 880 mV range.

Key Features

  • Core / Logic Capacity  Approximately 695,000 logic elements provide a high-density programmable fabric for complex logic and compute tasks.
  • Logic Array Blocks  Contains around 262,400 logic array blocks (CLBs) to structure and distribute logic resources across the device.
  • Embedded Memory  Approximately 51.2 Mbits of on-chip RAM for implemented buffering, state storage, and local data processing.
  • I/O Count  696 general-purpose I/O pins to support broad interfacing and parallel connectivity requirements.
  • Power  Operates with a core voltage supply range of 820 mV to 880 mV to support the device’s electrical requirements.
  • Package & Mounting  1517-BBGA (FCBGA) package; supplier device package listed as 1517-FBGA (40×40). Surface-mount mounting type.
  • Industrial Temperature Grade  Rated for operation from −40 °C to 100 °C to meet industrial environmental requirements.
  • Regulatory / Compliance  RoHS compliant.

Unique Advantages

  • High-density programmable logic: The device’s ~695,000 logic elements enable implementation of large, complex designs on a single FPGA.
  • Substantial embedded memory: Approximately 51.2 Mbits of on-chip RAM reduce the need for external memory in many data buffering and processing uses.
  • Extensive I/O capability: 696 I/O pins provide flexible connectivity for parallel interfaces and multiple external devices.
  • Industrial temperature rating: Specified operation from −40 °C to 100 °C supports deployment in a wide range of industrial environments.
  • Compact BGA package: The 1517-BBGA (1517-FBGA, 40×40) package supports surface-mount PCB integration while preserving a high pin count.
  • Standards-conscious supply: RoHS compliance aligns the device with common environmental and manufacturing requirements.

Why Choose 5SGSMD8K2F40I3LN?

The 5SGSMD8K2F40I3LN combines a very large logic fabric, ample embedded memory, and nearly 700 I/O pins in a single industrial-grade FCBGA package. It is suitable for designs that require concentrated programmable resources, significant on-chip storage, and robust thermal range for industrial deployments.

Selected where integration density, predictable electrical supply requirements (820–880 mV core), and compliance with RoHS are important, this Stratix V GS device provides a platform for scaling complex logic and I/O-heavy designs within a compact surface-mount package.

Request a quote or submit an inquiry for 5SGSMD8K2F40I3LN to receive pricing, availability, and technical documentation for this Stratix® V GS FPGA.

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