5SGSMD8K2F40I3N

The 5SGSMD8K2F40I3N is a Stratix® V GS field-programmable gate array (FPGA) from Intel designed for high-density programmable logic applications. It combines a large number of logic elements, substantial on-chip RAM, and a high I/O count in a 1517-ball FCBGA package to support complex, I/O-intensive designs.

Engineered for industrial use, this device operates over a wide temperature range and supports low-voltage core operation, making it suitable for systems that require robust environmental tolerance and compact, surface-mount integration.

Key Features

• Core Logic  695,000 logic elements (logic cells) provide significant capacity for large-scale digital designs and complex combinational/sequential logic implementations.
• Embedded Memory  Approximately 51.2 Mbits of total on-chip RAM for high-capacity buffering, storage of lookup tables, and data-path memory without external RAM.
• I/O Density  696 I/O pins enable extensive external connectivity for parallel interfaces, multi-channel systems, and dense board-level integration.
• Power Supply  Core voltage supported from 820 mV to 880 mV to match specified low-voltage power rails for the Stratix V core.
• Package & Mounting  1517-BBGA (1517-FBGA, 40×40) package in a surface-mount form factor for high-density PCB assembly and reliable board-level mounting.
• Industrial Temperature Grade  Rated for operation from −40 °C to 100 °C, suitable for industrial temperature environments.
• Compliance  RoHS compliant, meeting lead-free requirements for modern electronic assemblies.

Typical Applications

• High-density digital systems  Large-scale logic deployments that require hundreds of thousands of logic elements and abundant on-chip RAM to implement complex algorithms and state machines.
• I/O-intensive interface hubs  Systems that need a high number of external connections—parallel buses, multi-lane interfaces, or large sensor arrays—benefit from the 696 available I/Os.
• Industrial control and automation  Equipment operating across −40 °C to 100 °C can leverage this industrial-grade device for real-time control, signal aggregation, and deterministic logic tasks.
• Embedded memory–heavy designs  Applications requiring substantial on-chip buffering or LUT-based storage can use the approximately 51.2 Mbits of embedded RAM to reduce external memory dependency.

Unique Advantages

• Substantial logic capacity: 695,000 logic elements allow integration of large functions and multiple subsystems into a single device, simplifying board-level design.
• Significant on-chip memory: Approximately 51.2 Mbits of embedded RAM reduces the need for external memory and improves data-path latency and integration.
• High I/O count: 696 I/Os provide the flexibility to interface with numerous peripherals or parallel data channels without additional bridging logic.
• Industrial-rated operation: −40 °C to 100 °C operating range supports deployment in industrial environments where extended thermal tolerance is required.
• Compact surface-mount package: 1517-FBGA (40×40) provides a high-pin-count solution in a board-friendly surface-mount footprint for space-constrained systems.
• RoHS compliant: Meets lead-free assembly requirements for modern manufacturing workflows.

Why Choose 5SGSMD8K2F40I3N?

The 5SGSMD8K2F40I3N positions itself as a high-capacity, industrial-grade Stratix V GS FPGA option from Intel, delivering hundreds of thousands of logic elements, substantial embedded memory, and a very high I/O count in a reliable surface-mount FBGA package. Its specified core voltage range and industrial operating temperature make it suitable for demanding, board-level integration where density and robustness matter.

This device is well suited for engineering teams building complex, I/O-rich systems that require large on-chip resources and consistent thermal performance. As a member of the Stratix V family, it aligns with documented device electrical characteristics and package options for designers referencing family-level specifications.

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