5SGSMD8K3F40C2G

The 5SGSMD8K3F40C2G is a Stratix® V GS FPGA IC from Intel offering very large logic capacity and extensive I/O in a compact FCBGA package. It integrates 695,000 logic elements, approximately 51.2 Mbits of embedded memory, and up to 696 user I/O to support complex, high-density digital designs.

Designed as a commercial-grade, surface-mount FPGA, this device is specified for operation from 0 °C to 85 °C and a core supply voltage range of 870 mV to 930 mV, enabling precise power provisioning for board-level system integration.

Key Features

• Core capacity  695,000 logic elements for implementing large-scale digital logic and custom hardware functions.
• Embedded memory  Approximately 51.2 Mbits of on-chip RAM to support buffering, local storage, and memory-intensive designs.
• I/O resources  Up to 696 user I/O pins to interface with high-pin-count peripherals and multi-channel systems.
• Power  Core supply voltage range of 870 mV to 930 mV for controlled core-power design and optimization.
• Package and mounting  1517-BBGA (FCBGA) package; supplier device package listed as 1517-FBGA (40×40). Surface-mount design suitable for compact board layouts.
• Temperature and grade  Commercial grade operation from 0 °C to 85 °C for standard commercial electronic applications.
• RoHS compliance  Device is RoHS compliant.

Typical Applications

• High-density logic implementations  Use where hundreds of thousands of logic elements are required to implement complex RTL, custom accelerators, or large state machines.
• On-chip buffering and storage  Embedded memory supports local buffering, FIFOs, and temporary data storage for throughput-intensive operations.
• High-pin-count interfaces  Up to 696 I/O allow direct connection to multiple peripherals, parallel buses, and multi-channel I/O subsystems.
• Compact board designs  FCBGA 1517 package and surface-mount mounting enable dense, board-level integration where PCB real estate is constrained.

Unique Advantages

• Substantial logic resources: 695,000 logic elements provide headroom for complex functions and large-scale integration on a single device.
• Significant on-chip memory: Approximately 51.2 Mbits of embedded RAM reduces dependence on external memory for many buffering and staging tasks.
• Extensive I/O connectivity: 696 I/O pins support diverse system interfaces and multi-channel designs without additional hub components.
• Compact, board-friendly package: 1517-BBGA (FCBGA) and supplier 1517-FBGA (40×40) formats facilitate surface-mount assembly in space-constrained systems.
• Controlled core-voltage range: 870 mV–930 mV core supply simplifies power-rail design for the core domain.
• Commercial-grade operation: Rated for 0 °C to 85 °C to meet typical commercial deployment environments.

Why Choose 5SGSMD8K3F40C2G?

The 5SGSMD8K3F40C2G is positioned for designs that require very high logic density, substantial on-chip memory, and broad I/O capability in a compact BGA form factor. Its combination of 695,000 logic elements, approximately 51.2 Mbits of embedded RAM, and 696 I/O provides a balanced platform for complex digital systems where integration and board-level density matter.

As part of the Stratix V GS family, this device is documented by the Stratix V device datasheet covering electrical and switching characteristics, enabling detailed system-level planning for power, timing, and I/O integration.

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