5SGSMD8K3F40C2N

The 5SGSMD8K3F40C2N is an Intel Stratix V GS family FPGA optimized for high-density programmable logic and large on-chip memory requirements. It provides a combination of substantial logic capacity, significant embedded RAM, and a high pin count in a 1517-FBGA surface-mount package for complex digital designs.

This commercial-grade device is suited to designs that require abundant logic resources, extensive embedded memory, and broad I/O connectivity within a 0 °C to 85 °C operating range.

Key Features

• Core Logic  Approximately 695,000 logic elements, delivering large configurable logic capacity for complex designs.
• Embedded Memory  Approximately 51.2 Mbits of on-chip RAM (51,200,000 bits) to support large buffering, state storage, and memory-intensive functions.
• I/O Density  696 available I/O pins to support extensive interfacing and parallel connectivity requirements.
• Programmable Logic Structure  262,400 LABs (logic array blocks) to organize and distribute logic resources across the device.
• Power  Core voltage supply range of 0.870 V to 0.930 V for the device core domain.
• Package & Mounting  1517-FBGA (40×40) / 1517-BBGA FCBGA package in a surface-mount configuration for high-density board integration.
• Temperature & Grade  Commercial grade device with an operating temperature range of 0 °C to 85 °C.
• Environmental Compliance  RoHS compliant.

Typical Applications

• High-density digital processing  Use where large programmable logic resources are required to implement complex custom logic and algorithms.
• Memory-intensive functions  On-chip RAM capacity supports buffering, packet storage, and other memory-heavy tasks without relying on external memory.
• High I/O systems  Large I/O count enables designs that need broad parallel interfacing or multiple high-pin subsystems.
• Commercial electronics  Suited for commercial-temperature-range products and systems where surface-mount FBGA packaging is required.

Unique Advantages

• Large logic capacity: The approximately 695,000 logic elements enable implementation of complex, multi-function designs on a single device.
• Substantial on-chip memory: Approximately 51.2 Mbits of embedded RAM reduces dependence on external memory and simplifies board design.
• Extensive I/O: 696 I/O pins allow flexible, high-density interfacing for peripherals, sensors, and parallel data paths.
• Compact surface-mount package: 1517-FBGA (40×40) package balances high integration with standard surface-mount assembly processes.
• Commercial temperature grade: Rated for 0 °C to 85 °C operation to match a wide range of commercial product requirements.
• Regulatory alignment: RoHS compliance supports environmentally conscious manufacturing and sourcing.

Why Choose 5SGSMD8K3F40C2N?

The 5SGSMD8K3F40C2N delivers a blend of high logic density, extensive embedded memory, and broad I/O capability in a surface-mount FBGA package, positioned for commercial designs that require significant on-chip resources. Its core voltage range and documented operating characteristics make it suitable for engineers designing feature-rich, memory- and I/O-intensive systems.

This device is appropriate for development teams and OEMs looking to consolidate complex logic and memory functions into a single programmable device while maintaining standard commercial temperature operation and RoHS compliance.

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